{"product_id":"materials-and-failures-in-mems-and-nems-9781119083603","title":"Materials and Failures in MEMS and NEMS","description":"\u003cb\u003eBook Synopsis\u003c\/b\u003e\u003cbr\u003eThe fabrication of MEMS has been predominately achieved by etching the polysilicon material.   However, new materials are in large demands that could overcome the hurdles in fabrication or manufacturing process.\u003cbr\u003e\u003cbr\u003e\u003cb\u003eTable of Contents\u003c\/b\u003e\u003cbr\u003e\u003cp\u003e\u003cb\u003e1 Carbon as a MEMS Material 1\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eAmritha Rammohan and Ashutosh Sharma\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e1.1 Introduction 1\u003c\/p\u003e \u003cp\u003e1.2 Structure and Properties of Glassy Carbon 3\u003c\/p\u003e \u003cp\u003e1.3 Fabrication of C-MEMS Structures 4\u003c\/p\u003e \u003cp\u003e1.4 Integration of C-MEMS Structures with Other Materials 15\u003c\/p\u003e \u003cp\u003e1.5 Conclusion 18\u003c\/p\u003e \u003cp\u003e\u003cb\u003e2 Intelligent Model-Based Fault Diagnosis of MEMS 21\u003c\/b\u003e\u003cbr\u003e\u003ci\u003e Afshin Izadian\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e2.1 Introduction 21\u003c\/p\u003e \u003cp\u003e2.2 Model-Based Fault Diagnosis 29\u003c\/p\u003e \u003cp\u003e2.3 Self-Tuning Estimation 49\u003c\/p\u003e \u003cp\u003e\u003cb\u003e3 MEMS Heat Exchangers 63\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eB. Mathew and L. Weiss\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e3.1 Introduction 63\u003c\/p\u003e \u003cp\u003e3.2 Fundamentals of Thermodynamics, Fluid Mechanics, and Heat Transfer 67\u003c\/p\u003e \u003cp\u003e3.3 MEMS Heat Sinks 86\u003c\/p\u003e \u003cp\u003e3.4 MEMS Heat Pipes 92\u003c\/p\u003e \u003cp\u003e3.6 Need for Microscale Internal Flow Passages 113\u003c\/p\u003e \u003cp\u003e\u003cb\u003e4 Application of Porous Silicon in MEMS and Sensors Technology 121\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eL. Sujatha, Chirasree Roy Chaudhuri and Enakshi Bhattacharya\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e4.1 Introduction 121\u003c\/p\u003e \u003cp\u003e4.2 Porous Silicon in Biosensors 131\u003c\/p\u003e \u003cp\u003e4.3 Porous Silicon for Pressure Sensors 155\u003c\/p\u003e \u003cp\u003e4.4 Conclusion 165\u003c\/p\u003e \u003cp\u003e\u003cb\u003e5 MEMS\/NEMS Switches with Silicon to Silicon (Si-to-Si) Contact Interface 173\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eChengkuo Lee, Bo Woon Soon and You Qian\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e5.1 Introduction 173\u003c\/p\u003e \u003cp\u003e5.2 Bi-Stable CMOS Front End Silicon Nanofin (SiNF) Switch for Non-volatile Memory Based On Van Der Waals Force 175\u003c\/p\u003e \u003cp\u003e5.3 Vertically Actuated U-Shape Nanowire NEMS Switch 184\u003c\/p\u003e \u003cp\u003e5.4 A Vacuum Encapsulated Si-to-Si MEMS Switch for Rugged Electronics 187\u003c\/p\u003e \u003cp\u003e5.5 Summary 197\u003c\/p\u003e \u003cp\u003e\u003cb\u003e6 On the Design, Fabrication, and Characterization of cMUT Devices 201\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eJ. Jayapandian, K. Prabakar, C.S. Sundar and Baldev Raj\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e6.1 Introduction 201\u003c\/p\u003e \u003cp\u003e6.2 cMUT Design and Finite Element Modeling Simulation 203\u003c\/p\u003e \u003cp\u003e6.3 cMUT Fabrication and Characterization 205\u003c\/p\u003e \u003cp\u003e6.4 Summary and Conclusions 216\u003c\/p\u003e \u003cp\u003e\u003cb\u003e7 Inverse Problems in the MEMS\/NEMS Applications 219\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eYin Zhang\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e7.1 Introduction 219\u003c\/p\u003e \u003cp\u003e7.2 Inverse Problems in the Micro\/Nanomechanical Resonators 222\u003c\/p\u003e \u003cp\u003e7.3 Inverse Problems in the MEMS Stiction Test 231\u003c\/p\u003e \u003cp\u003e\u003cb\u003e8 Ohmic RF-MEMS Control 239\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eM. Spasos and R. Nilavalan\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e8.1 Introduction 239\u003c\/p\u003e \u003cp\u003e8.2 Charge Drive Control (Resistive Damping) 251\u003c\/p\u003e \u003cp\u003e8.3 Hybrid Drive Control 255\u003c\/p\u003e \u003cp\u003e8.4 Control Under High-Pressure Gas Damping 258\u003c\/p\u003e \u003cp\u003e8.5 Comparison between Different Control Modes 258\u003c\/p\u003e \u003cp\u003e\u003cb\u003e9 Dynamics of MEMS Devices 263\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eVamsy Godthi, K. Jayaprakash Reddy and Rudra Pratap\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e9.1 Introduction 263\u003c\/p\u003e \u003cp\u003e9.2 Modeling and Simulation 266\u003c\/p\u003e \u003cp\u003e9.3 Fabrication Methods 273\u003c\/p\u003e \u003cp\u003e9.4 Characterization 276\u003c\/p\u003e \u003cp\u003e9.5 Device Failures 280\u003c\/p\u003e \u003cp\u003e\u003cb\u003e10 Buckling Behaviors and Interfacial Toughness of a Micron-Scale Composite Structure with a Metal Wire on a Flexible Substrate 285\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eQinghua Wang, Huimin Xie and Yanjie Li\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e10.1 Introduction 285\u003c\/p\u003e \u003cp\u003e10.2 Buckling Behaviors of Constantan Wire under Electrical Loading 289\u003c\/p\u003e \u003cp\u003e10.3 Interfacial Toughness between Constantan Wire and Polymer Substrate 305\u003c\/p\u003e \u003cp\u003e10.4 Buckling Behaviors of Polymer Substrate Restricted by Constantan Wire 310\u003c\/p\u003e \u003cp\u003e10.5 Conclusions 321\u003c\/p\u003e \u003cp\u003e\u003cb\u003e11 Microcantilever-Based Nano-Electro-Mechanical Sensor Systems: Characterization, Instrumentation, and Applications 325\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eSheetal Patil and V. Ramgopal Rao\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e11.1 Introduction 325\u003c\/p\u003e \u003cp\u003e11.2 Operation Principle and Fundamental Models 327\u003c\/p\u003e \u003cp\u003e11.3 Microcantilever Sensor Fabrication 330\u003c\/p\u003e \u003cp\u003e11.4 Mechanical and Electrical Characterization of Microcantilevers 335\u003c\/p\u003e \u003cp\u003e11.5 Readout Principles 339\u003c\/p\u003e \u003cp\u003e11.6 Application of Microcantilever Sensors 344\u003c\/p\u003e \u003cp\u003e11.7 Energy Harvesting for Sensor Networks 349\u003c\/p\u003e \u003cp\u003e11.8 Conclusion 351\u003c\/p\u003e \u003cp\u003e\u003cb\u003e12 CMOS MEMS Integration 361\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eThejas and Navakanta Bhat\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e12.1 Introduction 361\u003c\/p\u003e \u003cp\u003e12.2 State-of-the-Art inertial Sensor 362\u003c\/p\u003e \u003cp\u003e12.3 Capacitance Sensing Techniques 366\u003c\/p\u003e \u003cp\u003e12.4 Capacitance Sensing Architectures 367\u003c\/p\u003e \u003cp\u003e12.5 Continuous Time Voltage Sensing Circuit 368\u003c\/p\u003e \u003cp\u003e12.6 CMOS ASIC Design 371\u003c\/p\u003e \u003cp\u003e12.7 Test Results of CMOS–MEMS Integration 377\u003c\/p\u003e \u003cp\u003e12.8 Electrical Reliability Issues 378\u003c\/p\u003e \u003cp\u003e\u003cb\u003e13 Solving Quality and Reliability Optimization Problems for MEMS with Degradation Data 381\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eYash Lundia, Kunal Jain, Mamanduru Vamsee Krishna, Manoj Kumar Tiwari and Baldev Raj\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e13.1 Introduction 382\u003c\/p\u003e \u003cp\u003e13.2 Notations and Assumptions 384\u003c\/p\u003e \u003cp\u003e13.3 Reliability Model 385\u003c\/p\u003e \u003cp\u003e13.4 Numerical Example 395\u003c\/p\u003e \u003cp\u003e13.5 Conclusions 397\u003c\/p\u003e \u003cp\u003eReferences 397\u003c\/p\u003e","brand":"John Wiley \u0026 Sons Inc","offers":[{"title":"Default Title","offer_id":49406981407063,"sku":"9781119083603","price":160.5,"currency_code":"GBP","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0817\/1739\/5799\/files\/9781119083603.jpg?v=1730497776","url":"https:\/\/bookcurl.com\/products\/materials-and-failures-in-mems-and-nems-9781119083603","provider":"Book Curl","version":"1.0","type":"link"}