{"product_id":"low-k-nanoporous-interdielectrics-materials-thin-film-fabrications-structures-properties-9781616687496","title":"Low-K Nanoporous Interdielectrics: Materials,","description":"\u003cb\u003eBook Synopsis\u003c\/b\u003e\u003cbr\u003eThe use of low dielectric constant (low-k) interdielectrics in multilevel structure integrated circuits (ICs) can lower line-to-line noise in interconnects and alleviate power dissipation issues by reducing the capacitance between the interconnect conductor lines. Because of these merits, low-k interdielectric materials are currently in high demand in the development of advanced ICs. One important approach to obtaining low-k values is the incorporation of nanopores into dielectrics. This book provides an overview of the methodologies and characterisation techniques used for investigating low-k nanoporous interdielectrics.","brand":"Nova Science Publishers Inc","offers":[{"title":"Default Title","offer_id":48886878208343,"sku":"9781616687496","price":999.99,"currency_code":"GBP","in_stock":false}],"url":"https:\/\/bookcurl.com\/products\/low-k-nanoporous-interdielectrics-materials-thin-film-fabrications-structures-properties-9781616687496","provider":"Book Curl","version":"1.0","type":"link"}