{"product_id":"leadfree-solders-9780470971826","title":"Leadfree Solders","description":"\u003cb\u003eBook Synopsis\u003c\/b\u003e\u003cbr\u003eProviding a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to allow continued widescale usage. \u003ci\u003eLead-free Solders: Materials Reliability for Electronics\u003c\/i\u003e chronicles the search for reliable drop-in lead-free alternatives and covers:  \u003cul\u003e \u003cli\u003ePhase diagrams and alloy development \u003c\/li\u003e \u003cli\u003eEffect of minor alloying additions \u003c\/li\u003e \u003cli\u003eComposite approaches including nanoscale reinforcements \u003c\/li\u003e \u003cli\u003eMechanical issues affecting reliability \u003c\/li\u003e \u003cli\u003eReliability under impact loading \u003c\/li\u003e \u003cli\u003eThermomechanical fatigue \u003c\/li\u003e \u003cli\u003eChemical issues affecting reliability \u003c\/li\u003e \u003cli\u003eWhisker growth \u003c\/li\u003e \u003cli\u003eElectromigration \u003c\/li\u003e \u003cli\u003eThermomigration \u003c\/li\u003e \u003c\/ul\u003e \u003cp\u003ePresenting a comprehensive understanding of the current state of lead-free electronic interconnects \u003cbr\u003e\u003cbr\u003e\u003cb\u003eTable of Contents\u003c\/b\u003e\u003cbr\u003eSeries Preface xv  \u003c\/p\u003e\u003cp\u003ePreface xvii\u003c\/p\u003e \u003cp\u003eList of Contributors xix\u003c\/p\u003e \u003cp\u003e\u003cb\u003eThematic Area I: Introduction 1\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e\u003cb\u003e1 Reliability of Lead-Free Electronic Solder Interconnects: Roles of Material and Service Parameters 3\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eK. N. Subramanian\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e1.1 Material Design for Reliable Lead-Free Electronic Solders Joints 3\u003c\/p\u003e \u003cp\u003e1.2 Imposed Fields and the Solder Joint Responses that Affect Their Reliability 5\u003c\/p\u003e \u003cp\u003e1.3 Mechanical Integrity 5\u003c\/p\u003e \u003cp\u003e1.4 Thermomechanical Fatigue (TMF) 6\u003c\/p\u003e \u003cp\u003e1.5 Whisker Growth 7\u003c\/p\u003e \u003cp\u003e1.6 Electromigration (EM) 7\u003c\/p\u003e \u003cp\u003e1.7 Thermomigration (TM) 8\u003c\/p\u003e \u003cp\u003e1.8 Other Potential Issues 8\u003c\/p\u003e \u003cp\u003e\u003cb\u003eThematic Area II: Phase Diagrams and Alloying Concepts 11\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e\u003cb\u003e2 Phase Diagrams and Their Applications in Pb-Free Soldering 13\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eSinn-wen Chen, Wojciech Gierlotka, Hsin-jay Wu, and Shih-kang Lin\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e2.1 Introduction 14\u003c\/p\u003e \u003cp\u003e2.2 Phase Diagrams of Pb-Free Solder Systems 14\u003c\/p\u003e \u003cp\u003e2.3 Example of Applications 23\u003c\/p\u003e \u003cp\u003e2.4 Conclusions 39\u003c\/p\u003e \u003cp\u003e\u003cb\u003e3 Phase Diagrams and Alloy Development 45\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eAlan Dinsdale, Andy Watson, Ales Kroupa, Jan Vrestal, Adela Zemanova, and Pavel Broz\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e3.1 Introduction 45\u003c\/p\u003e \u003cp\u003e3.2 Computational Thermodynamics as a Research Tool 48\u003c\/p\u003e \u003cp\u003e3.3 Thermodynamic Databases – the Underlying Basis of the Modelling of Phase Diagrams and Thermodynamic Properties, Databases for Lead-Free Solders 51\u003c\/p\u003e \u003cp\u003e3.4 Application of the SOLDERS Database to Alloy Development 57\u003c\/p\u003e \u003cp\u003e3.5 Conclusions 68\u003c\/p\u003e \u003cp\u003e\u003cb\u003e4 Interaction of Sn-based Solders with Ni(P) Substrates: Phase Equilibria and Thermochemistry 71\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eClemens Schmetterer, Rajesh Ganesan, and Herbert Ipser\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e4.1 Introduction 72\u003c\/p\u003e \u003cp\u003e4.2 Binary Phase Equilibria 73\u003c\/p\u003e \u003cp\u003e4.3 Ternary Phase Equilibria Ni-P-Sn 85\u003c\/p\u003e \u003cp\u003e4.4 Thermochemical Data 94\u003c\/p\u003e \u003cp\u003e4.5 Relevance of the Results and Conclusion 111\u003c\/p\u003e \u003cp\u003e\u003cb\u003eThematic Area III: Microalloying to Improve Reliability 119\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e\u003cb\u003e5 'Effects of Minor Alloying Additions on the Properties and Reliability of Pb-Free Solders and Joints' 121\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eSung K. Kang\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e5.1 Introduction 122\u003c\/p\u003e \u003cp\u003e5.2 Controlling Ag3Sn Plate Formation 125\u003c\/p\u003e \u003cp\u003e5.3 Controlling the Undercooling of Sn Solidification 132\u003c\/p\u003e \u003cp\u003e5.4 Controlling Interfacial Reactions 136\u003c\/p\u003e \u003cp\u003e5.5 Modifying the Microstructure of SAC 145\u003c\/p\u003e \u003cp\u003e5.6 Improving Mechanical Properties 149\u003c\/p\u003e \u003cp\u003e5.7 Enhancing Electromigration Resistance 151\u003c\/p\u003e \u003cp\u003e5.8 Summary 153\u003c\/p\u003e \u003cp\u003e\u003cb\u003e6 Development and Characterization of Nano-composite Solder 161\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eJohan Liu, Si Chen, and Lilei Ye\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e6.1 Introduction 162\u003c\/p\u003e \u003cp\u003e6.2 Nano-composite Solder Fabrication Process 162\u003c\/p\u003e \u003cp\u003e6.3 Microstructure 166\u003c\/p\u003e \u003cp\u003e6.4 Physical Properties 167\u003c\/p\u003e \u003cp\u003e6.5 Mechanical Properties 169\u003c\/p\u003e \u003cp\u003e6.6 Challenges and Solutions 171\u003c\/p\u003e \u003cp\u003e6.7 Summary 174\u003c\/p\u003e \u003cp\u003e\u003cb\u003eThematic Area IV: Chemical Issues Affecting Reliability 179\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e\u003cb\u003e7 Chemical Changes for Lead-Free Soldering and Their Effect on Reliability 181\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eLaura J. Turbini\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e7.1 Introduction 181\u003c\/p\u003e \u003cp\u003e7.2 Soldering Fluxes and Pastes 181\u003c\/p\u003e \u003cp\u003e7.3 Cleaning 185\u003c\/p\u003e \u003cp\u003e7.4 Laminates 185\u003c\/p\u003e \u003cp\u003e7.5 Halogen-Free Laminates 186\u003c\/p\u003e \u003cp\u003e7.6 Conductive Anodic Filament (CAF) Formation 189\u003c\/p\u003e \u003cp\u003e7.7 Summary 193\u003c\/p\u003e \u003cp\u003e\u003cb\u003eThematic Area V: Mechanical Issues Affecting Reliability 195\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e\u003cb\u003e8 Influence of Microstructure on Creep and High Strain Rate Fracture of Sn-Ag-Based Solder Joints 197\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eP. Kumar, Z. Huang, I. Dutta, G. Subbarayan, and R. Mahajan\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e8.1 Introduction 198\u003c\/p\u003e \u003cp\u003e8.2 Coarsening Kinetics: Quantitative Analysis of Microstructural Evolution 199\u003c\/p\u003e \u003cp\u003e8.3 Creep Behavior of Sn-Ag-Based Solders and the Effect of Aging 206\u003c\/p\u003e \u003cp\u003e8.4 Role of Microstructure on High Strain Rate Fracture 219\u003c\/p\u003e \u003cp\u003e8.5 Summary and Conclusions 227\u003c\/p\u003e \u003cp\u003e\u003cb\u003e9 Microstructure and Thermomechanical Behavior Pb-Free Solders 233\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eD.R. Frear\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e9.1 Introduction 233\u003c\/p\u003e \u003cp\u003e9.2 Sn-Pb Solder 234\u003c\/p\u003e \u003cp\u003e9.3 Pb-Free Solders 237\u003c\/p\u003e \u003cp\u003e9.4 Summary 248\u003c\/p\u003e \u003cp\u003e\u003cb\u003e10 Electromechanical Coupling in Sn-Rich Solder Interconnects 251\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eQ.S. Zhu, H.Y. Liu, L. Zhang, Q.L. Zeng, Z.G. Wang, and J.K. Shang\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e10.1 Introduction 252\u003c\/p\u003e \u003cp\u003e10.2 Experimental 253\u003c\/p\u003e \u003cp\u003e10.3 Results 255\u003c\/p\u003e \u003cp\u003e10.4 Discussion 264\u003c\/p\u003e \u003cp\u003e10.5 Conclusions 269\u003c\/p\u003e \u003cp\u003e\u003cb\u003e11 Effect of Temperature-Dependent Deformation Characteristics on Thermomechanical Fatigue Reliability of Eutectic Sn-Ag Solder Joints 273\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eAndre Lee, Deep Choudhuri, and K.N. Subramanian\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e11.1 Introduction 274\u003c\/p\u003e \u003cp\u003e11.2 Experimental Details 275\u003c\/p\u003e \u003cp\u003e11.3 Results and Discussion 276\u003c\/p\u003e \u003cp\u003e11.4 Summary and Conclusions 294\u003c\/p\u003e \u003cp\u003e\u003cb\u003eThematic Area VI: Whisker Growth Issues Affecting Reliability 297\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e\u003cb\u003e12 Sn Whiskers: Causes, Mechanisms and Mitigation Strategies 299\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eNitin Jadhav and Eric Chason\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e12.1 Introduction 299\u003c\/p\u003e \u003cp\u003e12.2 Features of Whisker Formation 303\u003c\/p\u003e \u003cp\u003e12.3 Understanding the Relationship between IMC Growth, Stress and Whisker Formation 308\u003c\/p\u003e \u003cp\u003e12.4 Summary Picture of Whisker Formation 314\u003c\/p\u003e \u003cp\u003e12.5 Strategies to Mitigate Whisker Formation 316\u003c\/p\u003e \u003cp\u003e12.6 Conclusion 318\u003c\/p\u003e \u003cp\u003e\u003cb\u003e13 Tin Whiskers 323\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eKatsuaki Suganuma\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e13.1 Low Melting Point Metals and Whisker Formation 323\u003c\/p\u003e \u003cp\u003e13.2 Room-Temperature Tin Whiskers on Copper Substrate 325\u003c\/p\u003e \u003cp\u003e13.3 Thermal-Cycling Whiskers on 42 Alloy\/Ceramics 326\u003c\/p\u003e \u003cp\u003e13.4 Oxidation\/Corrosion Whiskers 329\u003c\/p\u003e \u003cp\u003e13.5 Mechanical-Compression Whiskers in Connectors 330\u003c\/p\u003e \u003cp\u003e13.6 Electromigration Whiskers 331\u003c\/p\u003e \u003cp\u003e13.7 Whisker Mitigation 332\u003c\/p\u003e \u003cp\u003e13.8 Future Work 334\u003c\/p\u003e \u003cp\u003e\u003cb\u003eThematic Area VII: Electromigration Issues Affecting Reliability 337\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e\u003cb\u003e14 Electromigration Reliability of Pb-Free Solder Joints 339\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eSeung-Hyun Chae, Yiwei Wang, and Paul S. Ho\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e14.1 Introduction 339\u003c\/p\u003e \u003cp\u003e14.2 Failure Mechanisms of Solder Joints by Forced Atomic Migration 342\u003c\/p\u003e \u003cp\u003e14.3 IMC Growth 351\u003c\/p\u003e \u003cp\u003e14.4 Effect of Sn Grain Structure on EM Reliability 363\u003c\/p\u003e \u003cp\u003e14.5 Summary 366\u003c\/p\u003e \u003cp\u003e\u003cb\u003e15 Electromigration in Pb-Free Solder Joints in Electronic Packaging 375\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eChih Chen, Shih-Wei Liang, Yuan-Wei Chang, Hsiang-Yao Hsiao, Jung Kyu Han, and K.N. Tu\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e15.1 Introduction 376\u003c\/p\u003e \u003cp\u003e15.2 Unique Features for EM in Flip-Chip Pb-Free Solder Joints 376\u003c\/p\u003e \u003cp\u003e15.3 Changes of Physical Properties of Solder Bumps During EM 386\u003c\/p\u003e \u003cp\u003e15.4 Challenges for Understanding EM in Pb-Free Solder Microbumps 393\u003c\/p\u003e \u003cp\u003e15.5 Thermomigration of Cu and Ni in Pb-Free Solder Microbumps 394\u003c\/p\u003e \u003cp\u003e15.6 Summary 394\u003c\/p\u003e \u003cp\u003e\u003cb\u003e16 Effects of Electromigration on Electronic Solder Joints 401\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eSinn-wen Chen, Chih-ming Chen, Chao-hong Wang, and Chia-ming Hsu\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e16.1 Introduction 401\u003c\/p\u003e \u003cp\u003e16.2 Effects of Electromigration on Solders 402\u003c\/p\u003e \u003cp\u003e16.3 Effects of Electromigration on Interfacial Reactions 408\u003c\/p\u003e \u003cp\u003e16.4 Modeling Description of Effects of Electromigration on IMC Growth 414\u003c\/p\u003e \u003cp\u003e16.5 Conclusions 418\u003c\/p\u003e \u003cp\u003e\u003cb\u003eThematic Area VIII: Thermomigration Issues Affecting Reliability 423\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e\u003cb\u003e17 Thermomigration in SnPb and Pb-Free Flip-Chip Solder Joints 425\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eTian Tian, K.N. Tu, Hsiao-Yun Chen, Hsiang-Yao Hsiao, and Chih Chen\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e17.1 Introduction 425\u003c\/p\u003e \u003cp\u003e17.2 Thermomigration in SnPb Flip-Chip Solder Joints 427\u003c\/p\u003e \u003cp\u003e17.3 Thermomigration in Pb-Free Flip-Chip Solder Joints 432\u003c\/p\u003e \u003cp\u003e17.4 Driving Force of Thermomigration 435\u003c\/p\u003e \u003cp\u003e17.5 Coupling between Thermomigration and Creep 439\u003c\/p\u003e \u003cp\u003e17.6 Coupling between Thermomigration and Electromigration: Thermoelectric Effect on Electromigration 441\u003c\/p\u003e \u003cp\u003e17.7 Summary 441\u003c\/p\u003e \u003cp\u003e\u003cb\u003eThematic Area IX: Miniaturization Issues Affecting Reliability 443\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e\u003cb\u003e18 Influence of Miniaturization on Mechanical Reliability of Lead-Free Solder Interconnects 445\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eGolta Khatibi, Herbert Ipser, Martin Lederer, and Brigitte Weiss\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e18.1 Introduction 445\u003c\/p\u003e \u003cp\u003e18.2 Effect of Miniaturization on Static Properties of Solder Joints (Tensile and Shear) 448\u003c\/p\u003e \u003cp\u003e18.3 Creep and Relaxation of Solder Joints 475\u003c\/p\u003e \u003cp\u003e18.4 Summary and Conclusions 478\u003c\/p\u003e \u003cp\u003eReferences 482\u003c\/p\u003e \u003cp\u003eIndex 487\u003c\/p\u003e","brand":"John Wiley \u0026 Sons Inc","offers":[{"title":"Default Title","offer_id":49402470400343,"sku":"9780470971826","price":137.7,"currency_code":"GBP","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0817\/1739\/5799\/files\/9780470971826.jpg?v=1730480501","url":"https:\/\/bookcurl.com\/products\/leadfree-solders-9780470971826","provider":"Book Curl","version":"1.0","type":"link"}