{"product_id":"introduction-to-microelectronics-advanced-packaging-assurance-9783031861017","title":"Introduction to Microelectronics Advanced Packaging Assurance","description":"\u003cb\u003eBook Synopsis\u003c\/b\u003e\u003cbr\u003e\u003cp\u003eIntroduction to IC Packaging Development and Assembly Processes.- Bonding Techniques Interconnects.- CVD in Semiconductor Packaging.- Etching in Semiconductor Manufacturing: Techniques, Applications, and Performance Metrics in Advanced IC Packaging.- Physical Vapor Deposition in Advanced Semiconductor Packaging.\u003c\/p\u003e","brand":"Springer","offers":[{"title":"Default Title","offer_id":53195456512343,"sku":"9783031861017","price":44.99,"currency_code":"GBP","in_stock":true}],"url":"https:\/\/bookcurl.com\/products\/introduction-to-microelectronics-advanced-packaging-assurance-9783031861017","provider":"Book Curl","version":"1.0","type":"link"}