{"product_id":"guide-to-stateoftheart-electron-devices-9781118347263","title":"Guide to StateoftheArt Electron Devices","description":"\u003cb\u003eBook Synopsis\u003c\/b\u003e\u003cbr\u003e\u003cp\u003e\u003cb\u003eWinner, 2013 PROSE Award, Engineering and Technology\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003eConcise, high quality and comparative overview of state-of-the-art electron device development, manufacturing technologies and applications\u003c\/p\u003e \u003cp\u003e\u003ci\u003eGuide to State-of-the-Art Electron Devices\u003c\/i\u003e marks the 60th anniversary of the IRE electron devices committee and the 35th anniversary of the IEEE Electron Devices Society, as such it defines the state-of-the-art of electron devices, as well as future directions across the entire field.\u003c\/p\u003e \u003cul\u003e \u003cli\u003eSpans full range of electron device types such as photovoltaic devices, semiconductor manufacturing and VLSI technology and circuits, covered by IEEE Electron and Devices Society\u003c\/li\u003e \u003cli\u003eContributed by internationally respected members of the electron devices community\u003c\/li\u003e \u003cli\u003eA timely desk reference with fully-integrated colour and a unique lay-out with sidebars to highlight the key terms\u003c\/li\u003e \u003cli\u003eDiscusses the historical developments and speculates on future trends to \u003cbr\u003e\u003cbr\u003e\u003cb\u003eTable of Contents\u003c\/b\u003e\u003cbr\u003e\u003cp\u003eForeword xi\u003c\/p\u003e \u003cp\u003ePreface xiii\u003c\/p\u003e \u003cp\u003eContributors xvii\u003c\/p\u003e \u003cp\u003eAcknowledgments xix\u003c\/p\u003e \u003cp\u003eIntroduction: Historic Timeline xxi\u003c\/p\u003e \u003cp\u003e\u003cb\u003ePART I BASIC ELECTRON DEVICES\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e\u003cb\u003e1 Bipolar Transistors 3\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eJohn D. Cressler and Katsuyoshi Washio\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e1.1 Motivation 3\u003c\/p\u003e \u003cp\u003e1.2 The pn Junction and its Electronic Applications 5\u003c\/p\u003e \u003cp\u003e1.3 The Bipolar Junction Transistor and its Electronic Applications 10\u003c\/p\u003e \u003cp\u003e1.4 Optimization of Bipolar Transistors 15\u003c\/p\u003e \u003cp\u003e1.5 Silicon-Germanium Heterojunction Bipolar Transistors 17\u003c\/p\u003e \u003cp\u003eReferences 19\u003c\/p\u003e \u003cp\u003e\u003cb\u003e2 MOSFETs 21\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eHiroshi Iwai, Simon Min Sze, Yuan Taur and Hei Wong\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e2.1 Introduction 21\u003c\/p\u003e \u003cp\u003e2.2 MOSFET Basics 21\u003c\/p\u003e \u003cp\u003e2.3 The Evolution of MOSFETs 27\u003c\/p\u003e \u003cp\u003e2.4 Closing Remarks 31\u003c\/p\u003e \u003cp\u003eReferences 31\u003c\/p\u003e \u003cp\u003e\u003cb\u003e3 Memory Devices 37\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eKinam Kim and Dong Jin Jung\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e3.1 Introduction 37\u003c\/p\u003e \u003cp\u003e3.2 Volatile Memories 39\u003c\/p\u003e \u003cp\u003e3.3 Non-Volatile Memories 41\u003c\/p\u003e \u003cp\u003e3.4 Future Perspectives of MOS Memories 43\u003c\/p\u003e \u003cp\u003e3.5 Closing Remarks 45\u003c\/p\u003e \u003cp\u003eReferences 46\u003c\/p\u003e \u003cp\u003e\u003cb\u003e4 Passive Components 49\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eJoachim N. Burghartz and Colin C. McAndrew\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e4.1 Discrete and Integrated Passive Components 49\u003c\/p\u003e \u003cp\u003e4.2 Application in Analog ICs and DRAM 52\u003c\/p\u003e \u003cp\u003e4.3 The Planar Spiral Inductor–A Case Study 54\u003c\/p\u003e \u003cp\u003e4.4 Parasitics in Integrated Circuits 57\u003c\/p\u003e \u003cp\u003eReferences 57\u003c\/p\u003e \u003cp\u003e\u003cb\u003e5 Emerging Devices 59\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eSupriyo Bandyopadhyay, Marc Cahay and Avik W. Ghosh\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e5.1 Non-Charge-Based Switching 59\u003c\/p\u003e \u003cp\u003e5.2 Carbon as a Replacement for Silicon and the Rise of Grpahene Electronics and Moletronics 63\u003c\/p\u003e \u003cp\u003e5.3 Closing Remarks 66\u003c\/p\u003e \u003cp\u003eReferences 67\u003c\/p\u003e \u003cp\u003e\u003cb\u003ePART II ASPECTS OF DEVICE AND IC MANUFACTURING\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e\u003cb\u003e6 Electronic Materials 71\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eJames C. Sturm, Ken Rim, James S. Harris and Chung-Chih Wu\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e6.1 Introduction 71\u003c\/p\u003e \u003cp\u003e6.2 Silicon Device Technology 71\u003c\/p\u003e \u003cp\u003e6.3 Compound Semiconductor Devices 75\u003c\/p\u003e \u003cp\u003e6.4 Electronic Displays 79\u003c\/p\u003e \u003cp\u003e6.5 Closing Remarks 82\u003c\/p\u003e \u003cp\u003eReferences 83\u003c\/p\u003e \u003cp\u003e\u003cb\u003e7 Compact Modeling 85\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eColin C. McAndrew and Laurence W. Nagel\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e7.1 The Role of Compact Models 85\u003c\/p\u003e \u003cp\u003e7.2 Bipolar Transistor Compact Modeling 87\u003c\/p\u003e \u003cp\u003e7.3 MOS Transistor Compact Modeling 89\u003c\/p\u003e \u003cp\u003e7.4 Compact Modeling of Passive Components 92\u003c\/p\u003e \u003cp\u003e7.5 Benchmarking and Implementation 94\u003c\/p\u003e \u003cp\u003eReferences 94\u003c\/p\u003e \u003cp\u003e\u003cb\u003e8 Technology Computer Aided Design 97\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eDavid Esseni, Christoph Jungemann, J¨urgen Lorenz, Pierpaolo Palestri, Enrico Sangiorgi and Luca Selmi\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e8.1 Introduction 97\u003c\/p\u003e \u003cp\u003e8.2 Drift-Diffusion Model 98\u003c\/p\u003e \u003cp\u003e8.3 Microscopic Transport Models 100\u003c\/p\u003e \u003cp\u003e8.4 Quantum Transport Models 101\u003c\/p\u003e \u003cp\u003e8.5 Process and Equipment Simulation 102\u003c\/p\u003e \u003cp\u003eReferences 105\u003c\/p\u003e \u003cp\u003e\u003cb\u003e9 Reliability of Electron Devices, Interconnects and Circuits 107\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eAnthony S. Oates, Richard C. Blish, Gennadi Bersuker and Lu Kasprzak\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e9.1 Introduction and Background 107\u003c\/p\u003e \u003cp\u003e9.2 Device Reliability Issues 109\u003c\/p\u003e \u003cp\u003e9.3 Circuit-Level Reliability Issues 114\u003c\/p\u003e \u003cp\u003e9.4 Microscopic Approaches to Assuring Reliability of ICs 117\u003c\/p\u003e \u003cp\u003eReferences 117\u003c\/p\u003e \u003cp\u003e\u003cb\u003e10 Semiconductor Manufacturing 121\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eRajendra Singh, Luigi Colombo, Klaus Schuegraf, Robert Doering and Alain Diebold\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e10.1 Introduction 121\u003c\/p\u003e \u003cp\u003e10.2 Substrates 122\u003c\/p\u003e \u003cp\u003e10.3 Lithography and Etching 122\u003c\/p\u003e \u003cp\u003e10.4 Front-End Processing 124\u003c\/p\u003e \u003cp\u003e10.5 Back-End Processing 125\u003c\/p\u003e \u003cp\u003e10.6 Process Control 128\u003c\/p\u003e \u003cp\u003e10.7 Assembly and Test 129\u003c\/p\u003e \u003cp\u003e10.8 Future Directions 131\u003c\/p\u003e \u003cp\u003eReferences 131\u003c\/p\u003e \u003cp\u003e\u003cb\u003ePART III APPLICATIONS BASED ON ELECTRON DEVICES\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e\u003cb\u003e11 VLSI Technology and Circuits 135\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eKaustav Banerjee and Shuji Ikeda\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e11.1 Introduction 135\u003c\/p\u003e \u003cp\u003e11.2 MOSFET Scaling Trends 136\u003c\/p\u003e \u003cp\u003e11.3 Low-Power and High-Speed Logic Design 137\u003c\/p\u003e \u003cp\u003e11.4 Scaling Driven Technology Enhancements 139\u003c\/p\u003e \u003cp\u003e11.5 Ultra-Low Voltage Transistors 144\u003c\/p\u003e \u003cp\u003e11.6 Interconnects 144\u003c\/p\u003e \u003cp\u003e11.7 Memory Design 148\u003c\/p\u003e \u003cp\u003e11.8 System Integration 150\u003c\/p\u003e \u003cp\u003eReferences 152\u003c\/p\u003e \u003cp\u003e\u003cb\u003e12 Mixed-Signal Technologies and Integrated Circuits 157\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eBin Zhao and James A. Hutchby\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e12.1 Introduction 157\u003c\/p\u003e \u003cp\u003e12.2 Analog\/Mixed-Signal Technologies in Scaled CMOS 159\u003c\/p\u003e \u003cp\u003e12.3 Data Converter ICs 161\u003c\/p\u003e \u003cp\u003e12.4 Mixed-Signal Circuits for Low Power Displays 164\u003c\/p\u003e \u003cp\u003e12.5 Image Sensor Technologies and Circuits 166\u003c\/p\u003e \u003cp\u003eReferences 168\u003c\/p\u003e \u003cp\u003e\u003cb\u003e13 Memory Technologies 171\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eStephen Parke, Kristy A. Campbell and Chandra Mouli\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e13.1 Semiconductor Memory History 171\u003c\/p\u003e \u003cp\u003e13.2 State of Mainstream Semiconductor Memory Today 178\u003c\/p\u003e \u003cp\u003e13.3 Emerging Memory Technologies 183\u003c\/p\u003e \u003cp\u003e13.4 Closing Remarks 185\u003c\/p\u003e \u003cp\u003eReferences 186\u003c\/p\u003e \u003cp\u003e\u003cb\u003e14 RF and Microwave Semiconductor Technologies 189\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eGiovanni Ghione, Fabrizio Bonani, Ruediger Quay and Erich Kasper\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e14.1 III-V-Based: GaAs and InP 189\u003c\/p\u003e \u003cp\u003e14.2 Si and SiGe 194\u003c\/p\u003e \u003cp\u003e14.3 Wide Bandgap Devices (Group-III Nitrides, SiC and Diamond) 197\u003c\/p\u003e \u003cp\u003eReferences 199\u003c\/p\u003e \u003cp\u003e\u003cb\u003e15 Power Devices and ICs 203\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eRichard K. Williams, Mohamed N. Darwish, Theodore J. Letavic and Mikael O¨stling\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e15.1 Overview of Power Devices and ICs 203\u003c\/p\u003e \u003cp\u003e15.2 Two-Carrier and High-Power Devices 205\u003c\/p\u003e \u003cp\u003e15.3 Power MOSFET Devices 206\u003c\/p\u003e \u003cp\u003e15.4 High-Voltage and Power ICs 209\u003c\/p\u003e \u003cp\u003e15.5 Wide Bandgap Power Devices 210\u003c\/p\u003e \u003cp\u003eReferences 211\u003c\/p\u003e \u003cp\u003e\u003cb\u003e16 Photovoltaic Devices 213\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eSteven A. Ringel, Timothy J. Anderson, Martin A. Green, Rajendra Singh and Robert J. Walters\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e16.1 Introduction 213\u003c\/p\u003e \u003cp\u003e16.2 Silicon Photovoltaics 215\u003c\/p\u003e \u003cp\u003e16.3 Polycrystalline Thin-Film Photovoltaics 218\u003c\/p\u003e \u003cp\u003e16.4 III-V Compound Photovoltaics 219\u003c\/p\u003e \u003cp\u003e16.5 Future Concepts in Photovoltaics 220\u003c\/p\u003e \u003cp\u003eReferences 222\u003c\/p\u003e \u003cp\u003e\u003cb\u003e17 Large Area Electronics 225\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eArokia Nathan, Arman Ahnood, Jackson Lai and Xiaojun Guo\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e17.1 Thin-Film Solar Cells 225\u003c\/p\u003e \u003cp\u003e17.2 Large Area Imaging 229\u003c\/p\u003e \u003cp\u003e17.3 Flat Panel Displays 233\u003c\/p\u003e \u003cp\u003eReferences 235\u003c\/p\u003e \u003cp\u003e\u003cb\u003e18 Microelectromechanical Systems (MEMS) 239\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eDarrin J. Young and Hanseup Kim\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e18.1 Introduction 239\u003c\/p\u003e \u003cp\u003e18.2 The 1960s – First Micromachined Structures Envisioned 239\u003c\/p\u003e \u003cp\u003e18.3 The 1970s – Integrated Sensors Started 240\u003c\/p\u003e \u003cp\u003e18.4 The 1980s – Surface Micromachining Emerged 241\u003c\/p\u003e \u003cp\u003e18.5 The 1990s – MEMS Impacted Various Fields 244\u003c\/p\u003e \u003cp\u003e18.6 The 2000s – Diversified Sophisticated Systems Enabled by MEMS 247\u003c\/p\u003e \u003cp\u003e18.7 Future Outlook 248\u003c\/p\u003e \u003cp\u003eReferences 248\u003c\/p\u003e \u003cp\u003e\u003cb\u003e19 Vacuum Device Applications 251\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eDavid K. Abe, Baruch Levush, Carter M. Armstrong, Thomas Grant and William L. Menninger\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e19.1 Introduction 251\u003c\/p\u003e \u003cp\u003e19.2 Traveling-Wave Devices 252\u003c\/p\u003e \u003cp\u003e19.3 Klystrons 255\u003c\/p\u003e \u003cp\u003e19.4 Inductive Output Tubes 258\u003c\/p\u003e \u003cp\u003e19.5 Crossed-Field Devices 259\u003c\/p\u003e \u003cp\u003e19.6 Gyro-Devices 260\u003c\/p\u003e \u003cp\u003eReferences 262\u003c\/p\u003e \u003cp\u003e\u003cb\u003e20 Optoelectronic Devices 265\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eLeda Lunardi, Sudha Mokkapati and Chennupati Jagadish\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e20.1 Introduction 265\u003c\/p\u003e \u003cp\u003e20.2 Light Emission in Semiconductors 266\u003c\/p\u003e \u003cp\u003e20.3 Photodetectors 268\u003c\/p\u003e \u003cp\u003e20.4 Integrated Optoelectronics 269\u003c\/p\u003e \u003cp\u003e20.5 Optical Interconnects 271\u003c\/p\u003e \u003cp\u003e20.6 Closing Remarks 271\u003c\/p\u003e \u003cp\u003eReferences 271\u003c\/p\u003e \u003cp\u003e\u003cb\u003e21 Devices for the Post CMOS Era 275\u003c\/b\u003e\u003cbr\u003e \u003ci\u003eWilfried Haensch\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e21.1 Introduction 275\u003c\/p\u003e \u003cp\u003e21.2 Devices for the 8-nm Node with Conventional Materials 277\u003c\/p\u003e \u003cp\u003e21.3 New Channel Materials and Devices 282\u003c\/p\u003e \u003cp\u003e21.4 Closing Remarks 287\u003c\/p\u003e \u003cp\u003eReferences 287\u003c\/p\u003e \u003cp\u003eIndex 291\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"John Wiley \u0026 Sons Inc","offers":[{"title":"Default Title","offer_id":49406854922583,"sku":"9781118347263","price":41.75,"currency_code":"GBP","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0817\/1739\/5799\/files\/9781118347263.jpg?v=1730497354","url":"https:\/\/bookcurl.com\/products\/guide-to-stateoftheart-electron-devices-9781118347263","provider":"Book Curl","version":"1.0","type":"link"}