{"product_id":"failure-analysis-9780470748244","title":"Failure Analysis","description":"\u003cb\u003eBook Synopsis\u003c\/b\u003e\u003cbr\u003eFailure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes.\u003cbr\u003e\u003cbr\u003e\u003cb\u003eTable of Contents\u003c\/b\u003e\u003cbr\u003eSeries Editor’s Foreword.  \u003cp\u003eForeword by Dr. Craig Hillman.\u003c\/p\u003e \u003cp\u003eSeries Editor’s Preface.\u003c\/p\u003e \u003cp\u003ePreface.\u003c\/p\u003e \u003cp\u003eAbout the Authors.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e1 Introduction.\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e1.1. The Three Goals of the Book.\u003c\/p\u003e \u003cp\u003e1.2. Historical Perspective\u003c\/p\u003e \u003cp\u003e1.3. Terminology.\u003c\/p\u003e \u003cp\u003e1.4. State of the Art and Future Trends.\u003c\/p\u003e \u003cp\u003e1.5. General Plan of the Book.\u003c\/p\u003e \u003cp\u003eReferences.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e2 Failure Analysis - Why?\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e2.1. Eight Possible Applications.\u003c\/p\u003e \u003cp\u003e2.2. Forensic Engineering.\u003c\/p\u003e \u003cp\u003e2.3. Reliability Modeling.\u003c\/p\u003e \u003cp\u003e2.4. Reverse Engineering.\u003c\/p\u003e \u003cp\u003e2.5. Controlling Critical Input Variables.\u003c\/p\u003e \u003cp\u003e2.6. Design for Reliability.\u003c\/p\u003e \u003cp\u003e2.7. Process Improvement.\u003c\/p\u003e \u003cp\u003e2.8. Saving Money by Early Control.\u003c\/p\u003e \u003cp\u003e2.9. A Synergetic Approach.\u003c\/p\u003e \u003cp\u003eReferences.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e3 Failure Analysis - When?\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e3.1. During Development Cycle.\u003c\/p\u003e \u003cp\u003e3.2. Preparing the Fabrication.\u003c\/p\u003e \u003cp\u003e3.3. FA during Fabrication.\u003c\/p\u003e \u003cp\u003e3.4. FA after Fabrication.\u003c\/p\u003e \u003cp\u003e3.5. FA during Operation or Storage.\u003c\/p\u003e \u003cp\u003eReferences.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e4 Failure Analysis - How?\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e4.1. Procedures for failure analysis.\u003c\/p\u003e \u003cp\u003e4.2. Techniques for decapsulating the device and for sample preparation.\u003c\/p\u003e \u003cp\u003e4.3. Techniques for failure analysis.\u003c\/p\u003e \u003cp\u003eReferences.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e5. Failure Analysis - What?\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e5.1 Failure Modes and Mechanisms at Various Process Steps.\u003c\/p\u003e \u003cp\u003e5.2 Failure Modes and Mechanisms of Passive Electronic Parts.\u003c\/p\u003e \u003cp\u003e5.3 Failure Modes and Mechanisms of Silicon Bipolar Technology.\u003c\/p\u003e \u003cp\u003e5.4 Failure Modes and Mechanisms of MOS Technology.\u003c\/p\u003e \u003cp\u003e5.5 Failure Modes and Mechanisms of Optoelectronic and Photonic Technologies.\u003c\/p\u003e \u003cp\u003e5.6 Failure Modes and Mechanisms of Non-Silicon Technologies.\u003c\/p\u003e \u003cp\u003e5.7 Failure Modes and Mechanisms of Hybrid Technology.\u003c\/p\u003e \u003cp\u003e5.8 Failure Modes and Mechanisms of Microsystem Technologies.\u003c\/p\u003e \u003cp\u003eReferences.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e6 Case Studies.\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e6.1 Case Study No. 1: Capacitors.\u003c\/p\u003e \u003cp\u003e6.2 Case Study No. 2: Bipolar Power Devices.\u003c\/p\u003e \u003cp\u003e6.3 Case Study No. 3: CMOS Devices.\u003c\/p\u003e \u003cp\u003e6.4 Case Study No. 4: MOS Field Effect Transistors.\u003c\/p\u003e \u003cp\u003e6.5 Case Study No. 5: Thin Film Transistors.\u003c\/p\u003e \u003cp\u003e6.6 Case Study No. 6: High Electron Mobility Transistors.\u003c\/p\u003e \u003cp\u003e6.7 Case Study No. 7: MEMS Resonators.\u003c\/p\u003e \u003cp\u003e6.8 Case Study No. 8: MEMS Micro-Cantilevers.\u003c\/p\u003e \u003cp\u003e6.9 Case Study No. 9: MEMS Switches.\u003c\/p\u003e \u003cp\u003e6.10 Case Study No. 10: Magnetic MEMS Switches.\u003c\/p\u003e \u003cp\u003e6.11 Case Study No. 11: Chip-Scale Packages.\u003c\/p\u003e \u003cp\u003e6.12 Case Study No. 12: Solder Joints.\u003c\/p\u003e \u003cp\u003e6.13 Conclusions.\u003c\/p\u003e \u003cp\u003eReferences.\u003c\/p\u003e \u003cp\u003e\u003cb\u003e7. Conclusions.\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003eReferences.\u003c\/p\u003e \u003cp\u003e\u003cb\u003eAcronyms.\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e\u003cb\u003eGlossary.\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e\u003cb\u003eIndex.\u003c\/b\u003e\u003c\/p\u003e","brand":"John Wiley \u0026 Sons Inc","offers":[{"title":"Default Title","offer_id":49402425508183,"sku":"9780470748244","price":79.16,"currency_code":"GBP","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0817\/1739\/5799\/files\/9780470748244.jpg?v=1730480361","url":"https:\/\/bookcurl.com\/products\/failure-analysis-9780470748244","provider":"Book Curl","version":"1.0","type":"link"}