{"product_id":"esd-testing-cl-9780470511916","title":"ESD Testing CL","description":"\u003cb\u003eBook Synopsis\u003c\/b\u003e\u003cbr\u003ePresenting information on electrostatic discharge (ESD) and the characterization of semiconductor devices, this book examines ESD physical models and discusses the test systems and testing and specifications of each model, including the RF ESD test systems and magnetic recording (MR) systems and latchup.\u003cbr\u003e\u003cbr\u003e\u003cb\u003eTable of Contents\u003c\/b\u003e\u003cbr\u003e\u003cp\u003eAbout the Author xvii\u003c\/p\u003e \u003cp\u003ePreface xix\u003c\/p\u003e \u003cp\u003eAcknowledgments xxiii\u003c\/p\u003e \u003cp\u003e\u003cb\u003e1 Introduction 1\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e1.1 Testing for ESD, EMI, EOS, EMC, and Latchup 1\u003c\/p\u003e \u003cp\u003e1.2 Component and System Level Testing 1\u003c\/p\u003e \u003cp\u003e1.3 Qualification Testing 2\u003c\/p\u003e \u003cp\u003e1.4 ESD Standards 3\u003c\/p\u003e \u003cp\u003e1.5 Component Level Standards 6\u003c\/p\u003e \u003cp\u003e1.6 System Level Standards 7\u003c\/p\u003e \u003cp\u003e1.7 Factory and Material Standards 7\u003c\/p\u003e \u003cp\u003e1.8 Characterization Testing 8\u003c\/p\u003e \u003cp\u003e1.9 ESD Library Characterization and Qualification 12\u003c\/p\u003e \u003cp\u003e1.10 ESD Component Standards and Chip Architectures 12\u003c\/p\u003e \u003cp\u003e1.11 System Level Characterization 13\u003c\/p\u003e \u003cp\u003e1.12 Summary and Closing Comments 13\u003c\/p\u003e \u003cp\u003eProblems 14\u003c\/p\u003e \u003cp\u003eReferences 15\u003c\/p\u003e \u003cp\u003e\u003cb\u003e2 Human Body Model 17\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e2.1 History 17\u003c\/p\u003e \u003cp\u003e2.2 Scope 18\u003c\/p\u003e \u003cp\u003e2.3 Purpose 18\u003c\/p\u003e \u003cp\u003e2.4 Pulse Waveform 18\u003c\/p\u003e \u003cp\u003e2.5 Equivalent Circuit 19\u003c\/p\u003e \u003cp\u003e2.6 Test Equipment 20\u003c\/p\u003e \u003cp\u003e2.7 Test Sequence and Procedure 23\u003c\/p\u003e \u003cp\u003e2.8 Failure Mechanisms 25\u003c\/p\u003e \u003cp\u003e2.9 HBM ESD Current Paths 26\u003c\/p\u003e \u003cp\u003e2.10 HBM ESD Protection Circuit Solutions 28\u003c\/p\u003e \u003cp\u003e2.11 Alternate Test Methods 32\u003c\/p\u003e \u003cp\u003e2.12 HBM Two-Pin Stress 34\u003c\/p\u003e \u003cp\u003e2.13 HBM Small Step Stress 37\u003c\/p\u003e \u003cp\u003e2.14 Summary and Closing Comments 38\u003c\/p\u003e \u003cp\u003eProblems 39\u003c\/p\u003e \u003cp\u003eReferences 39\u003c\/p\u003e \u003cp\u003e\u003cb\u003e3 Machine Model 43\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e3.1 History 43\u003c\/p\u003e \u003cp\u003e3.2 Scope 43\u003c\/p\u003e \u003cp\u003e3.3 Purpose 43\u003c\/p\u003e \u003cp\u003e3.4 Pulse Waveform 44\u003c\/p\u003e \u003cp\u003e3.5 Equivalent Circuit 45\u003c\/p\u003e \u003cp\u003e3.6 Test Equipment 45\u003c\/p\u003e \u003cp\u003e3.7 Test Sequence and Procedure 47\u003c\/p\u003e \u003cp\u003e3.8 Failure Mechanisms 49\u003c\/p\u003e \u003cp\u003e3.9 MM ESD Current Paths 49\u003c\/p\u003e \u003cp\u003e3.10 MM ESD Protection Circuit Solutions 52\u003c\/p\u003e \u003cp\u003e3.11 Alternate Test Methods 55\u003c\/p\u003e \u003cp\u003e3.12 Machine Model to Human Body Model Ratio 57\u003c\/p\u003e \u003cp\u003e3.13 Machine Model Status as an ESD Standard 58\u003c\/p\u003e \u003cp\u003e3.14 Summary and Closing Comments 58\u003c\/p\u003e \u003cp\u003eProblems 59\u003c\/p\u003e \u003cp\u003eReferences 59\u003c\/p\u003e \u003cp\u003e\u003cb\u003e4 Charged Device Model (CDM) 61\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e4.1 History 61\u003c\/p\u003e \u003cp\u003e4.2 Scope 61\u003c\/p\u003e \u003cp\u003e4.3 Purpose 62\u003c\/p\u003e \u003cp\u003e4.4 Pulse Waveform 62\u003c\/p\u003e \u003cp\u003e4.5 Equivalent Circuit 65\u003c\/p\u003e \u003cp\u003e4.6 Test Equipment 65\u003c\/p\u003e \u003cp\u003e4.7 Test Sequence and Procedure 67\u003c\/p\u003e \u003cp\u003e4.8 Failure Mechanisms 69\u003c\/p\u003e \u003cp\u003e4.9 CDM ESD Current Paths 70\u003c\/p\u003e \u003cp\u003e4.10 CDM ESD Protection Circuit Solutions 72\u003c\/p\u003e \u003cp\u003e4.11 Alternative Test Methods 74\u003c\/p\u003e \u003cp\u003e4.12 Charged Board Model (CBM) 75\u003c\/p\u003e \u003cp\u003e4.13 Summary and Closing Comments 77\u003c\/p\u003e \u003cp\u003eProblems 79\u003c\/p\u003e \u003cp\u003eReferences 80\u003c\/p\u003e \u003cp\u003e\u003cb\u003e5 Transmission Line Pulse (TLP) Testing 84\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e5.1 History 84\u003c\/p\u003e \u003cp\u003e5.2 Scope 85\u003c\/p\u003e \u003cp\u003e5.3 Purpose 85\u003c\/p\u003e \u003cp\u003e5.4 Pulse Waveform 86\u003c\/p\u003e \u003cp\u003e5.5 Equivalent Circuit 87\u003c\/p\u003e \u003cp\u003e5.6 Test Equipment 88\u003c\/p\u003e \u003cp\u003e5.7 Test Sequence and Procedure 95\u003c\/p\u003e \u003cp\u003e5.8 TLP Pulsed I–V Characteristic 98\u003c\/p\u003e \u003cp\u003e5.9 Alternate Methods 101\u003c\/p\u003e \u003cp\u003e5.10 TLP-to-HBM Ratio 104\u003c\/p\u003e \u003cp\u003e5.11 Summary and Closing Comments 104\u003c\/p\u003e \u003cp\u003eProblems 104\u003c\/p\u003e \u003cp\u003eReferences 105\u003c\/p\u003e \u003cp\u003e\u003cb\u003e6 Very Fast Transmission Line Pulse (VF-TLP) Testing 108\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e6.1 History 108\u003c\/p\u003e \u003cp\u003e6.2 Scope 108\u003c\/p\u003e \u003cp\u003e6.3 Purpose 108\u003c\/p\u003e \u003cp\u003e6.4 Pulse Waveform 109\u003c\/p\u003e \u003cp\u003e6.5 Equivalent Circuit 111\u003c\/p\u003e \u003cp\u003e6.6 Test Equipment Configuration 111\u003c\/p\u003e \u003cp\u003e6.7 Test Sequence and Procedure 117\u003c\/p\u003e \u003cp\u003e6.8 VF-TLP Pulsed I–V Characteristics 121\u003c\/p\u003e \u003cp\u003e6.9 Alternate Test Methods 124\u003c\/p\u003e \u003cp\u003e6.10 Summary and Closing Comments 125\u003c\/p\u003e \u003cp\u003eProblems 128\u003c\/p\u003e \u003cp\u003eReferences 128\u003c\/p\u003e \u003cp\u003e\u003cb\u003e7 IEC 61000-4-2 130\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e7.1 History 130\u003c\/p\u003e \u003cp\u003e7.2 Scope 130\u003c\/p\u003e \u003cp\u003e7.3 Purpose 130\u003c\/p\u003e \u003cp\u003e7.4 Pulse Waveform 131\u003c\/p\u003e \u003cp\u003e7.5 Equivalent Circuit 133\u003c\/p\u003e \u003cp\u003e7.6 Test Equipment 133\u003c\/p\u003e \u003cp\u003e7.7 Test Sequence and Procedure 135\u003c\/p\u003e \u003cp\u003e7.8 Failure Mechanisms 137\u003c\/p\u003e \u003cp\u003e7.9 IEC 61000-4-2 ESD Current Paths 138\u003c\/p\u003e \u003cp\u003e7.10 ESD Protection Circuitry Solutions 139\u003c\/p\u003e \u003cp\u003e7.11 Alternative Test Methods 140\u003c\/p\u003e \u003cp\u003e7.12 Summary and Closing Comments 143\u003c\/p\u003e \u003cp\u003eProblems 143\u003c\/p\u003e \u003cp\u003eReferences 144\u003c\/p\u003e \u003cp\u003e\u003cb\u003e8 Human Metal Model (HMM) 147\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e8.1 History 147\u003c\/p\u003e \u003cp\u003e8.2 Scope 147\u003c\/p\u003e \u003cp\u003e8.3 Purpose 148\u003c\/p\u003e \u003cp\u003e8.4 Pulse Waveform 148\u003c\/p\u003e \u003cp\u003e8.5 Equivalent Circuit 149\u003c\/p\u003e \u003cp\u003e8.6 Test Equipment 149\u003c\/p\u003e \u003cp\u003e8.7 Test Configuration 150\u003c\/p\u003e \u003cp\u003e8.8 Test Sequence and Procedure 153\u003c\/p\u003e \u003cp\u003e8.9 Failure Mechanisms 157\u003c\/p\u003e \u003cp\u003e8.10 ESD Current Paths 158\u003c\/p\u003e \u003cp\u003e8.11 ESD Protection Circuit Solutions 158\u003c\/p\u003e \u003cp\u003e8.12 Summary and Closing Comments 160\u003c\/p\u003e \u003cp\u003eProblems 160\u003c\/p\u003e \u003cp\u003eReferences 161\u003c\/p\u003e \u003cp\u003e\u003cb\u003e9 IEC 61000-4-5 163\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e9.1 History 163\u003c\/p\u003e \u003cp\u003e9.2 Scope 164\u003c\/p\u003e \u003cp\u003e9.3 Purpose 164\u003c\/p\u003e \u003cp\u003e9.4 Pulse Waveform 165\u003c\/p\u003e \u003cp\u003e9.5 Equivalent Circuit 166\u003c\/p\u003e \u003cp\u003e9.6 Test Equipment 166\u003c\/p\u003e \u003cp\u003e9.7 Test Sequence and Procedure 168\u003c\/p\u003e \u003cp\u003e9.8 Failure Mechanisms 168\u003c\/p\u003e \u003cp\u003e9.9 IEC 61000-4-5 ESD Current Paths 170\u003c\/p\u003e \u003cp\u003e9.10 ESD Protection Circuit Solutions 170\u003c\/p\u003e \u003cp\u003e9.11 Alternate Test Methods 171\u003c\/p\u003e \u003cp\u003e9.12 Summary and Closing Comments 171\u003c\/p\u003e \u003cp\u003eProblems 172\u003c\/p\u003e \u003cp\u003eReferences 172\u003c\/p\u003e \u003cp\u003e\u003cb\u003e10 Cable Discharge Event (CDE) 174\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e10.1 History 174\u003c\/p\u003e \u003cp\u003e10.2 Scope 175\u003c\/p\u003e \u003cp\u003e10.3 Purpose 175\u003c\/p\u003e \u003cp\u003e10.4 Cable Discharge Event – Charging, Discharging, and Pulse Waveform 175\u003c\/p\u003e \u003cp\u003e10.5 Equivalent Circuit 178\u003c\/p\u003e \u003cp\u003e10.6 Test Equipment 179\u003c\/p\u003e \u003cp\u003e10.7 Test Measurement 180\u003c\/p\u003e \u003cp\u003e10.8 Test Procedure 185\u003c\/p\u003e \u003cp\u003e10.9 Measurement of a Cable in Different Conditions 185\u003c\/p\u003e \u003cp\u003e10.10 Transient Field Measurements 195\u003c\/p\u003e \u003cp\u003e10.11 Telecommunication Cable Discharge Test System 195\u003c\/p\u003e \u003cp\u003e10.12 Cable Discharge Current Paths 200\u003c\/p\u003e \u003cp\u003e10.13 Failure Mechanisms 200\u003c\/p\u003e \u003cp\u003e10.14 Cable Discharge Event (CDE) Protection 201\u003c\/p\u003e \u003cp\u003e10.15 Alternative Test Methods 203\u003c\/p\u003e \u003cp\u003e10.16 Summary and Closing Comments 204\u003c\/p\u003e \u003cp\u003eProblems 204\u003c\/p\u003e \u003cp\u003eReferences 204\u003c\/p\u003e \u003cp\u003e\u003cb\u003e11 Latchup 206\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e11.1 History 206\u003c\/p\u003e \u003cp\u003e11.2 Purpose 208\u003c\/p\u003e \u003cp\u003e11.3 Scope 209\u003c\/p\u003e \u003cp\u003e11.4 Pulse Waveform 209\u003c\/p\u003e \u003cp\u003e11.5 Equivalent Circuit 209\u003c\/p\u003e \u003cp\u003e11.6 Test Equipment 209\u003c\/p\u003e \u003cp\u003e11.7 Test Sequence and Procedure 211\u003c\/p\u003e \u003cp\u003e11.8 Failure Mechanisms 215\u003c\/p\u003e \u003cp\u003e11.9 Latchup Current Paths 216\u003c\/p\u003e \u003cp\u003e11.10 Latchup Protection Solutions 216\u003c\/p\u003e \u003cp\u003e11.11 Alternate Test Methods 222\u003c\/p\u003e \u003cp\u003e11.12 Single Event Latchup (SEL) Test Methods 224\u003c\/p\u003e \u003cp\u003e11.13 Summary and Closing Comments 224\u003c\/p\u003e \u003cp\u003eProblems 227\u003c\/p\u003e \u003cp\u003eReferences 227\u003c\/p\u003e \u003cp\u003e\u003cb\u003e12 Electrical Overstress (EOS) 230\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e12.1 History 230\u003c\/p\u003e \u003cp\u003e12.2 Scope 232\u003c\/p\u003e \u003cp\u003e12.3 Purpose 233\u003c\/p\u003e \u003cp\u003e12.4 Pulse Waveform 233\u003c\/p\u003e \u003cp\u003e12.5 Equivalent Circuit 233\u003c\/p\u003e \u003cp\u003e12.6 Test Equipment 234\u003c\/p\u003e \u003cp\u003e12.7 Test Procedure and Sequence 234\u003c\/p\u003e \u003cp\u003e12.8 Failure Mechanisms 236\u003c\/p\u003e \u003cp\u003e12.9 Electrical Overstress (EOS) Protection Circuit Solutions 240\u003c\/p\u003e \u003cp\u003e12.10 Electrical Overstress (EOS) Testing – TLP Method and EOS 249\u003c\/p\u003e \u003cp\u003e12.11 Electrical Overstress (EOS) Testing – DC and Transient Latchup Testing 252\u003c\/p\u003e \u003cp\u003e12.12 Summary and Closing Comments 252\u003c\/p\u003e \u003cp\u003eProblems 252\u003c\/p\u003e \u003cp\u003eReferences 253\u003c\/p\u003e \u003cp\u003e\u003cb\u003e13 Electromagnetic Compatibility (EMC) 257\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e13.1 History 257\u003c\/p\u003e \u003cp\u003e13.2 Purpose 258\u003c\/p\u003e \u003cp\u003e13.3 Scope 258\u003c\/p\u003e \u003cp\u003e13.4 Pulse Waveform 258\u003c\/p\u003e \u003cp\u003e13.5 Equivalent Circuit 259\u003c\/p\u003e \u003cp\u003e13.6 Test Equipment 259\u003c\/p\u003e \u003cp\u003e13.7 Test Procedures 261\u003c\/p\u003e \u003cp\u003e13.8 Failure Mechanisms 261\u003c\/p\u003e \u003cp\u003e13.9 ESD\/EMC Current Paths 263\u003c\/p\u003e \u003cp\u003e13.10 EMC Solutions 264\u003c\/p\u003e \u003cp\u003e13.11 Alternative Test Methods 266\u003c\/p\u003e \u003cp\u003e13.12 EMC\/ESD Product Evaluation – IC Prequalification 267\u003c\/p\u003e \u003cp\u003e13.13 EMC\/ESD Scanning Detection – Upset Evaluation 267\u003c\/p\u003e \u003cp\u003e13.14 EMC\/ESD Product Qualification Process 268\u003c\/p\u003e \u003cp\u003e13.15 Alternative ESD\/EMC Scanning Methods 271\u003c\/p\u003e \u003cp\u003e13.16 Current Reconstruction Methodology 276\u003c\/p\u003e \u003cp\u003e13.17 Printed Circuit Board (PCB) Design EMC Solutions 277\u003c\/p\u003e \u003cp\u003e13.18 Summary and Closing Comments 280\u003c\/p\u003e \u003cp\u003eProblems 281\u003c\/p\u003e \u003cp\u003eReferences 282\u003c\/p\u003e \u003cp\u003eA Glossary of Terms 284\u003c\/p\u003e \u003cp\u003eB Standards 288\u003c\/p\u003e \u003cp\u003eB.1 ESD Association 288\u003c\/p\u003e \u003cp\u003eB.2 International Organization of Standards 289\u003c\/p\u003e \u003cp\u003eB.3 IEC 289\u003c\/p\u003e \u003cp\u003eB.4 RTCA 289\u003c\/p\u003e \u003cp\u003eB.5 Department of Defense 289\u003c\/p\u003e \u003cp\u003eB.6 Military Standards 289\u003c\/p\u003e \u003cp\u003eB.7 Airborne Standards and Lightning 290\u003c\/p\u003e \u003cp\u003eIndex 291\u003c\/p\u003e","brand":"John Wiley \u0026 Sons Inc","offers":[{"title":"Default Title","offer_id":49525376418135,"sku":"9780470511916","price":83.66,"currency_code":"GBP","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0817\/1739\/5799\/files\/9780470511916.jpg?v=1731860282","url":"https:\/\/bookcurl.com\/products\/esd-testing-cl-9780470511916","provider":"Book Curl","version":"1.0","type":"link"}