{"product_id":"ceramic-interconnect-and-ceramic-microsystems-technologies-proceedings-cicmt-2005-9780930815769","title":"Ceramic Interconnect and Ceramic Microsystems","description":"\u003cb\u003eBook Synopsis\u003c\/b\u003e\u003cbr\u003eThis proceedings collection on CD-ROM is from the 1st International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT)held in April, 2005.    This is a must-have resource for anyone involved in the Microelectronics field.\u003cbr\u003e\u003cbr\u003e\u003cb\u003eTable of Contents\u003c\/b\u003e\u003cbr\u003e\u003cb\u003eKEYNOTE PRESENTATIONS.\u003cbr\u003e \u003c\/b\u003ePresent and Future Challenges in Multilayer Ceramic Devices (C.A. Randall, G. Yang, E. Dickey, R. Eitel, E. Semouchkina, G. Semouchkina, A. Baker, M.T. Lanagan, S. Rhee).\u003cbr\u003e Current and Future Directions for Ceramic Interconnect (C. Hoffmann, S. Brunner, M. Noren).\u003cbr\u003e Materials Process and Manufacturing: Current and Future Directions (A. Roosen).\u003cbr\u003e \u003cbr\u003e   \u003cp\u003e\u003cb\u003eMATERIALS SOLUTION FOR MICROSYSTEMS.\u003c\/b\u003e\u003cbr\u003e On-Board Fiber Alignment in LTCC Optoelectronic Packages (R. Eitel, A. Baker, J. Agraz, M. Lanagan, K. Uchino, C. Randall).\u003cbr\u003e Photosensitive Dielectric Paste for Micro-Patterning Technology in LTCC System (H.T. Kim, K.W. Kang, J.-H. Nam, D.H. Yeo, K.J. Kim, J. Kim, T. Masaki).\u003cbr\u003e Micro Channel Fabrication in LTCC Substrate (W. Kinzy Jones, S. Kappagantula, J. Wang).\u003cbr\u003e Development and Evaluation of Hermetic Ceramic Microwave Packages for Space Applications (J. Mueller, J. Pohlner, D. Schwanke, G. Reppe, H. Thust, R. Perrone).\u003cbr\u003e \u003cb\u003e\u003cbr\u003e COFIRING PROCESSES.\u003cbr\u003e \u003c\/b\u003eCofiring of Mixed LTCC Dielectric Laminates (J.-H. Jean, J.-C. Chang, S.-C. Lin).\u003cbr\u003e Modeling to Understand, Predict, and Control LTCC Tape Shrinkage and Density During Firing (K. Ewsuk, M. Reiterer, J. Arguello, C. DiAntonio).\u003cbr\u003e Densification and Crystallization of DuPont 943 Tape During Firing (K. Ewsuk, M. Reiterer, T. Garino).\u003cbr\u003e \u003cb\u003e\u003cbr\u003e MICROSYSTEM MATERIALS \u0026amp; INTEGRATION.\u003cbr\u003e \u003c\/b\u003eIntegration Concepts for the Fabrication of LTCC Structures (A. Baker, M. Lanagan, C. Randall, E. Semouchkina, G. Semouchkina, K.Z. Rajab, R. Mittra, R. Eitel, S. Rhee, P. Geggler, G. Fuhr).\u003cbr\u003e Development and Processing of an Anodic Bondable LTCC Tape (E. Müller, T. Bartnitzek, F. Bechtold, B. Pawlowski, P. Rothe, R. Ehrt, A. Heymel, E. Weiland, T. Schroter, S. Schundau, K. Kaschlik).\u003cbr\u003e Fabrication of LTCC Micro-Fludic Devices Using Sacrificial Carbon Layers (H. Birol, T. Maeder, C. Jacq, G. Corradini, R. Passerini, Y. Fourneir, S. Straessler, P. Ryser).\u003cbr\u003e LTCC Phase Shifter Modules for RF-MEMS-Switch Integration (T. Bartnitzek, E. Müller, R. van Dijk).\u003cbr\u003e \u003cbr\u003e \u003cb\u003eDIMENSIONAL CONTROL IN LTCC SYSTEMS\u003cbr\u003e \u003c\/b\u003eZero Shrinkage of LTCC by Self-Constrained Sintering (T. Rabe, W.A. Schiller, T. Hochheimer, C. Modes, A. Kipka).\u003cbr\u003e Self-Constrained Sintering LTCC - A Reliable Solution for Automotive Electronic Application (A. Kipka, C. Modes, Q. Reynolds, M. Neidert, S. Malkmus, F. Gora).\u003cbr\u003e Via Fill for Zero X-Y Shrink LTCC Tapes (W. Zhang, D. Malanga, T. Hochheimer, P. Bokalo).\u003cbr\u003e Novel Self-Constrained Sintered Composites of Dielectric and Ferrite LTCC Tapes for Microwave Applications (M. Hagymasi, A. Roosen, R. Karmazin, S. Walter, A. Naeini, R. Matz).\u003cbr\u003e \u003cbr\u003e \u003cb\u003eKEYNOTE PRESENTATION.\u003c\/b\u003e\u003cbr\u003e Ceramic Microstructure for Automotive Applications (G. Schneider)\u003cbr\u003e \u003cb\u003e\u003cbr\u003e CERAMIC MICROSYSTEMS AND APPLICATIONS I.\u003cbr\u003e \u003c\/b\u003eProgress in MEMS and Micro Systems Research (C. Liu).\u003cbr\u003e Miniaturized Sensor Elements Based on LTCC Technology for Automotive and Airborne Applications (U. Schmid, H. Seidel, T. Becker).\u003cbr\u003e LTCC Sensors for Environmental Monitoring System (M.R. Gongora-Rubio, S.T. Kofuji, A.C. Seabra, E. Del Moral Hernandez, E.W. Simões, P.B. Verdonck, M.B.A. Fontes).\u003cbr\u003e \u003cb\u003e\u003cbr\u003e PROCESSING INTEGRATED PASSIVES IN LTCC.\u003c\/b\u003e\u003cbr\u003e Post-Thermal Heat Treatment for Adjusting Buried Resistor Values in DuPont 943\u003csup\u003eTM\u003c\/sup\u003e LTCC (D.S. Krueger, E. Parker, G. Barner, H. Morgenstern, F. Uribe, S. Reed).\u003cbr\u003e Magnetic Thin Film Technologies for Integrated Passives (K.-K. Choi, S. Sato, R. Chen, N. Mellen).\u003cbr\u003e Characterization of Dried Thick-Film Resistors (K. Krueger).\u003cbr\u003e Methods to Improve Yield and Efficiency in Laser Trim of Embedded Components (D. Hague).\u003cbr\u003e \u003cb\u003e\u003cbr\u003e CERAMIC MICROSYSTEMS AND APPLICATIONS II.\u003cbr\u003e \u003c\/b\u003eNovel Microsystem Applications with New Techniques in LTCC (K.A. Peterson, K.D. Patel, C.K. Ho, S.B. Rohde, C.D. Nordquist, C.A. Walker, B.W. Wroblewski, M. Okandan).\u003cbr\u003e Preparation of Polymeric Microspheres by an Emulsification\/Solvent Diffusion Process Employing LTCC Microfluidic Structures (M.R. Gongora-Rubio, M.Rodrigues da Cunha, A. Penido de Oliveira Costa).\u003cbr\u003e Development of a Monopropellant Micro-Nozzle in Low Temperature Cofired Ceramic Tape (D.G. Plumee, J. Steciak, A.J. Moll).\u003cbr\u003e \u003cbr\u003e \u003cb\u003eMATERIALS INTEGRATION IN LTCC.\u003c\/b\u003e\u003cbr\u003e Low Sintering Ni-Cu-Zn-Ferrite Tapes for LTCC Integrated Inductors (S. Barth, F. Bechtold, E. Müller, J. Mürbe, J. Töpfer).\u003cbr\u003e Micron Scale Conductors and Integrated Passives in LTCC's (Electrophoretic Deposition by J.J. Van Tassel, C.A. Randall).\u003cbr\u003e Bulk Materials in LTCC Multilayers (M. Hintz, R. Perrone, H. Thust).\u003cbr\u003e \u003cb\u003e\u003cbr\u003e KEYNOTE PRESENTATION.\u003cbr\u003e \u003c\/b\u003eIntegrated Design and Simulation Tools for Microsystems Packaging: Current Capabilities and Future Needs (M. Desmulliez).\u003cbr\u003e \u003cb\u003e\u003cbr\u003e DESIGN AND FABRICATION OF CERAMIC MICROSYSTEMS AND DEVICES.\u003c\/b\u003e\u003cbr\u003e Modular Micro Reaction System Including Ceramic Components (T. Moritz, R. Lenk, J. Adler, M. Zins).\u003cbr\u003e Ceramics in Microtechnology - Materials, Processing, Design (H.J. Ritzhaupt-Kleissl, J. Hauβelt, R. Ruprecht).\u003cbr\u003e Integrated Design and Simulation Tools for Microfluidic Systems (S. Krishnamoorthy, A.S. Bedekar, J.J. Feng, S. Sundaram).\u003cbr\u003e Fabrication of Microfluidic Oscillators by Laser Milling in Sintered LTCC and Quartz Substrates (R. Furlan, M. Perez Tolentino, I. Ramos, J.J. Santiago-Aviles).\u003cbr\u003e \u003cb\u003e\u003cbr\u003e DESIGN, SIMULATION AND MODELING.\u003cbr\u003e \u003c\/b\u003eMaterial Selection for Ceramic T\/R Module Packages (R. Yamada, A. Piloto, E. Graddy, G. Aguirre, M. Eblen, A. Knudsen).\u003cbr\u003e Designing with LTCC in High Frequency Applications (T.P. Mobley, D.I. Amey).\u003cbr\u003e High-Performance Co-Planar Ferrite Inductors for RF Applications (M.D. Phillips, R.K. Settaluri).\u003cbr\u003e Novel Crosstalk Suppression Schemes Employing Magnetic Thin Films (A. Sligar, R.K. Settaluri, C.-H. Chang).\u003c\/p\u003e \u003cp\u003e\u003cb\u003eCERAMIC MICROSYSTEMS AND DEVICES.\u003c\/b\u003e\u003cbr\u003e LTCC Microfludic System (L.J. Golonka, T. Zawada, J. Radojewski, H. Roguszczak, M. Stefanow).\u003cbr\u003e Meso-Scale Remote Plasma Generator Using LTCC Technology (R.K. Yamamoto, P.B. Verdonck, M.R. Gongora-Rubio).\u003cbr\u003e Mini- and Micro-Channel Devices in LTCC (A.J. Moll, J. Youngsman, D.G. Plumlee, M. Schimpf).\u003cbr\u003e Processing of Ceramic Micro Parts via Low-Pressure Injection Molding (M. Müller, W. Bauer, H.J. Ritzhaupt-Kleissl).\u003cbr\u003e \u003cbr\u003e \u003cb\u003eCHARACTERIZING MATERIALS INTEGRATION EFFECTS.\u003cbr\u003e \u003c\/b\u003eCharacterization of Dielectrics and Conductors for Ceramic Microsystems at Microwave Frequency (M. Lanagan, L. Haney, S. Perini, K. Rajab, E. Semouchkina).\u003cbr\u003e Materials Compatibility Issues in LTCC Technology and Their Effects on Structure and Electrical Properties (H. Birol, T. Maeder, P. Ryser).\u003cbr\u003e Sintering Behavior of a LTCC Material and Influence of Silver on the Sintering Behavior (D. Tramosljika, J. Schaefer, C. Rixecker, F. Aldinger).\u003cbr\u003e Interfacial Reaction Between Silver Electrode and La-Si-B-O-Mullite Glass Ceramics (Y.-J. Wang, W.-C.J. Wei).\u003c\/p\u003e \u003cp\u003e\u003cb\u003eKEYNOTE PRESENTATION.\u003c\/b\u003e\u003cbr\u003e Next-Generation Microsystems: Integration Technologies and Opportunities for Ceramics (D. Dimos).\u003cbr\u003e \u003cb\u003eCERAMICS: THE MICROSYSTEM DEVICE ENABLER.\u003c\/b\u003e\u003cbr\u003e LTCC Wet Chemical Analysis Meso-Systems (N. Ibáñez-Garcia, J.A. Chamarro, Z. Mendes Rocha, M.R. Gongora-Rubio).\u003cbr\u003e Development of Microfluidic Devices Using LTCC Substrates (R.E. Bruzetti Leminski, E.W. Simões, R. Furlan, M.R. Gongora-Rubio, Z. Mendes da Rocha, M. Rodrigues da Cunha, N.I. Morimoto, I. Ramos, J.J. Santiago-Aviles).\u003cbr\u003e Hot-Plate Gas Sensors - Are Ceramics Better? (J. Kita, F. Rettig, R. Moos, K.-H. Drüe, H. Thust).\u003cbr\u003e A Comparative Study of the Technology and Architecture for Actuators Realized with PZT Layers in LTCC Structures (D. Belavic, M. Santo Zarnik, M. Hrovat, J. Holc, M. Kosec, B. Malic, S. Drnovsek, J. Cilensek).\u003c\/p\u003e \u003cp\u003e\u003cb\u003eINK JET PRINTING TECHNOLOGY\u003c\/b\u003e\u003cbr\u003e Ink Jet Printing of PZT (B. Derby, T. Wang).\u003cbr\u003e DoD-Printing of Conductive Silver Tracks (D. Cibis, K. Krueger ).\u003c\/p\u003e \u003cp\u003e\u003cb\u003eMICROSYSTEM MATERIALS AND FABRICATION.\u003c\/b\u003e\u003cbr\u003e Via Formation in LTCC Tape: A Comparison of Technologies (K.-J. Wolter, L. Rebenklau, G. Hagen).\u003cbr\u003e Direct-Write Laser Exposure of Photosensitive Conductive Inks Using Shaped-Beam Optics (S. Corbett, J. Strole, E. Swenson, W. Lu).\u003cbr\u003e High-Volume Print Forming, HVPF\u003csup\u003eTM\u003c\/sup\u003e - A New Method for Manufacturing Large Volumes of Complex Metal-Ceramic and Hybrid Components (A.L. Chait).\u003cbr\u003e Cold Low Pressure Lamination of Ceramic Green Tapes (A. Roosen, K. Schindler).\u003c\/p\u003e","brand":"John Wiley \u0026 Sons Inc","offers":[{"title":"Default Title","offer_id":49406528520535,"sku":"9780930815769","price":302.4,"currency_code":"GBP","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0817\/1739\/5799\/files\/9780930815769.jpg?v=1730496168","url":"https:\/\/bookcurl.com\/products\/ceramic-interconnect-and-ceramic-microsystems-technologies-proceedings-cicmt-2005-9780930815769","provider":"Book Curl","version":"1.0","type":"link"}