{"product_id":"ceramic-integration-and-joining-technologies-9780470391228","title":"Ceramic Integration and Joining Technologies","description":"\u003cb\u003eBook Synopsis\u003c\/b\u003e\u003cbr\u003eThis book joins and integrates ceramics and ceramic-based materials in various sectors of technology. A major imperative is to extract scientific information on joining and integration response of real, as well as model, material systems currently in a developmental stage.  \u003cp\u003e This book envisions integration in its broadest sense as a fundamental enabling technology at multiple length scales that span the macro, millimeter, micrometer and nanometer ranges. Consequently, the book addresses integration issues in such diverse areas as space power and propulsion, thermoelectric power generation, solar energy, micro-electro-mechanical systems (MEMS), solid oxide fuel cells (SOFC), multi-chip modules, prosthetic devices, and implanted biosensors and stimulators. The engineering challenge of designing and manufacturing complex structural, functional, and smart components and devices for the above applications from smaller, geometrically simpler units requires innovative development of new in\u003cbr\u003e\u003cbr\u003e\u003cb\u003eTable of Contents\u003c\/b\u003e\u003cbr\u003e\u003c\/p\u003e\u003cp\u003e\u003ci\u003ePreface ix\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e\u003ci\u003eContributors xi\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e\u003cb\u003ePART I INTRODUCTION 1\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e1 CERAMIC INTEGRATION ACROSS LENGTH SCALES: TECHNICAL ISSUES, CHALLENGES, AND OPPORTUNITIES 3\u003cbr\u003e \u003ci\u003eMrityunjay Singh, Tatsuki Ohji, Rajiv Asthana, and Sanjay Mathur\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e\u003cb\u003ePART II SCIENCE AND TECHNOLOGY FOR MACROSCALE INTEGRATION 15\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e2 CERAMIC COMPONENT INTEGRATION BY ADVANCED BRAZING TECHNOLOGIES 17\u003cbr\u003e \u003ci\u003eJolanta Janczak-Rusch\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e3 JOINING AND INTEGRATION ISSUES OF CERAMIC MATRIX COMPOSITES FOR THE NUCLEAR INDUSTRY 39\u003cbr\u003e \u003ci\u003eMonica Ferraris, Milena Salvo, and Valentina Casalegno\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e4 AIR BRAZING: A NEW METHOD OF CERAMIC–CERAMIC AND CERAMIC–METAL JOINING 91\u003cbr\u003e \u003ci\u003eK. S. Weil, J. T. Darsell, and J. Y. Kim\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e5 DIFFUSION BONDING OF SILICON CARBIDE AS AN ENABLING TECHNOLOGY FOR THE FABRICATION OF COMPLEX-SHAPED CERAMIC COMPONENTS 143\u003cbr\u003e \u003ci\u003eMichael C. Halbig and Mrityunjay Singh\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e6 INTEGRATION OF CARBON–CARBON COMPOSITE TO METALLIC SYSTEMS FOR THERMAL MANAGEMENT APPLICATIONS 163\u003cbr\u003e \u003ci\u003eMrityunjay Singh and Rajiv Asthana\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e7 CONTACT INTERACTION IN CARBON–METAL SYSTEMS FOR JOINING AND INTEGRATION 193\u003cbr\u003e \u003ci\u003eV. M. Perevertailo and O. B. Loginova\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e\u003cb\u003ePART III INTEGRATION ISSUES IN ENERGY GENERATION AND DEVICE FABRICATION 231\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e8 INTEGRATION TECHNOLOGIES FOR FERRITES AND POWER INDUCTORS IN CERAMIC CIRCUIT BOARDS 233\u003cbr\u003e \u003ci\u003eRichard Matz\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e9 OXIDE THERMOELECTRIC POWER GENERATION 267\u003cbr\u003e \u003ci\u003eRyoji Funahashi, Saori Urata, Atsuko Kosuga, and Delphine Flahaut\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e10 INTEGRATION TECHNOLOGIES FOR SOLID OXIDE FUEL CELLS (SOFCS) AND OTHER ELECTROCHEMICAL REACTORS 297\u003cbr\u003e \u003ci\u003eYoshinobu Fujishiro, Toshio Suzuki, Toshiro Yamaguchi, Koichi Hamamoto, Masanobu Awano, and Nigel Sammes\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e11 INTEGRATION TECHNOLOGIES FOR SENSORS 323\u003cbr\u003e \u003ci\u003eWoosuck Shin, Maiko Nishibori, and Ichiro Matsubara\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e12 ON-CHIP INTEGRATION OF FUNCTIONAL HYBRID MATERIALS AND COMPONENTS IN NANOPHOTONICS AND OPTOELECTRONICS 339\u003cbr\u003e \u003ci\u003eTalha Erdem and Hilmi Volkan Demir\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e13 INTEGRATION OF MULTIFUNCTIONAL PROPERTIES IN THERMAL BARRIER COATINGS BY CHEMICAL VAPOR DEPOSITION 393\u003cbr\u003e \u003ci\u003eTakashi Goto\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e14 THE CHANGING PHYSICS IN METAL INTERCONNECT RELIABILITY 415\u003cbr\u003e \u003ci\u003eCher Ming Tan and Yuejin Hou\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e15 INTEGRATION ISSUES OF BARIUM STRONTIUM TITANATE THIN FILM FOR TUNABLE MICROWAVE APPLICATIONS 449\u003cbr\u003e \u003ci\u003eAshok Kumar, Supriya Ketkar, and Venkataraman Gurumurthy\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e16 AEROSOL DEPOSITION (AD) INTEGRATION TECHNIQUES AND THEIR APPLICATION TO MICRODEVICES 489\u003cbr\u003e \u003ci\u003eJun Akedo\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e\u003cb\u003ePART IV NANO- AND BIOINTEGRATION 521\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e17 ADVANCES IN NANOINTEGRATION METHODOLOGIES: PATTERNING, POSITIONING, AND SELF-ASSEMBLY 523\u003cbr\u003e \u003ci\u003eYoshitake Masuda and Kunihito Koumoto\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e18 INTEGRATION OF NANOWIRES IN NEW DEVICES AND CIRCUIT ARCHITECTURES: RECENT DEVELOPMENTS AND CHALLENGES 575\u003cbr\u003e \u003ci\u003eF. Hernández-Ramírez, J. D. Prades, A. Romano-Rodriguez, S. Barth, H. Shen, and S. Mathur\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e19 INTEGRATING DIAMOND-LIKE CARBON INTO NANOSTRUCTURE DESIGNS (FABRICATING MICROSCALE AND NANOSCALE ARCHITECTURES OF DIAMOND-LIKE CARBON FILMS) 641\u003cbr\u003e \u003ci\u003eXijun Li and Daniel H. C. Chua\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e20 SYNTHESIS, PROPERTIES, INTEGRATION, AND APPLICATIONS OF VERTICALLY ALIGNED CERAMIC NANOSTRUCTURES 671\u003cbr\u003e \u003ci\u003eD. Pliszka, S. Sundarrajan, and S. Ramakrishna\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e21 NANOINTEGRATION BASED ON THIN-FILM TECHNOLOGY 699\u003cbr\u003e \u003ci\u003eC. Jin, W. Wei, R. Aggarwal, and R. J. Narayan\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e22 MASS-MANUFACTURABLE NANOWIRE INTEGRATION: CHALLENGES AND RECENT DEVELOPMENTS 721\u003cbr\u003e \u003ci\u003eAtaur Sarkar and M. Saif Islam\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e23 USABILITY OF INK-JET PRINTING TECHNOLOGY AND NANOMATERIALS IN ELECTRICAL INTERCONNECTIONS, ELECTRONIC PACKAGING, AND SYSTEM INTEGRATION FOR MICROELECTRONICS APPLICATIONS 743\u003cbr\u003e \u003ci\u003eUmur Caglar, Ville Pekkanen, Jani Valkama, Pauliina Mansikkamäki, and Jussi Pekkanen\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e24 BIOINTEGRATION OF PROSTHETIC DEVICES 777\u003cbr\u003e \u003ci\u003eMasakazu Kawashita, Toshiki Miyazaki, and Chikara Ohtsuki\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e\u003ci\u003eIndex 803\u003c\/i\u003e\u003c\/p\u003e","brand":"John Wiley \u0026 Sons Inc","offers":[{"title":"Default Title","offer_id":49402321142103,"sku":"9780470391228","price":150.26,"currency_code":"GBP","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0817\/1739\/5799\/files\/9780470391228.jpg?v=1730480063","url":"https:\/\/bookcurl.com\/products\/ceramic-integration-and-joining-technologies-9780470391228","provider":"Book Curl","version":"1.0","type":"link"}