{"product_id":"antennainpackage-technology-and-applications-9781119556633","title":"AntennainPackage Technology and Applications","description":"\u003cb\u003eBook Synopsis\u003c\/b\u003e\u003cbr\u003e\u003cp\u003e\u003cb\u003eA comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e\u003ci\u003eAntenna-in-Package Technology and Applications\u003c\/i\u003econtains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authorswell-known experts on the topicexplain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packagingbased AiP, and 3D-printing-based AiP.\u003cbr\u003e \u003cbr\u003e The book includes a detailed discussion of the surface laminar circuitbased AiP designs for large-scale mm-wave phased arra\u003cbr\u003e\u003cbr\u003e\u003cb\u003eTable of Contents\u003c\/b\u003e\u003cbr\u003e\u003c\/p\u003e\u003cp\u003eList of Contributors xiii\u003c\/p\u003e \u003cp\u003ePreface xv\u003c\/p\u003e \u003cp\u003eAbbreviations xix\u003c\/p\u003e \u003cp\u003e\u003cb\u003e1 Introduction \u003c\/b\u003e\u003cb\u003e1\u003cbr\u003e\u003c\/b\u003e\u003ci\u003eYueping Zhang\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e1.1 Background 1\u003c\/p\u003e \u003cp\u003e1.2 The Idea 3\u003c\/p\u003e \u003cp\u003e1.3 Exploring the Idea 4\u003c\/p\u003e \u003cp\u003e1.3.1 Bluetooth Radio and Other RF Applications 4\u003c\/p\u003e \u003cp\u003e1.3.2 60-GHz Radio and Other Millimeter-wave Applications 7\u003c\/p\u003e \u003cp\u003e1.4 Developing the Idea into a Mainstream Technology 8\u003c\/p\u003e \u003cp\u003e1.5 Concluding Remarks 11\u003c\/p\u003e \u003cp\u003eAcknowledgements 12\u003c\/p\u003e \u003cp\u003eReferences 12\u003c\/p\u003e \u003cp\u003e\u003cb\u003e2 Antennas \u003c\/b\u003e\u003cb\u003e17\u003cbr\u003e\u003c\/b\u003e\u003ci\u003eYueping Zhang\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e2.1 Introduction 17\u003c\/p\u003e \u003cp\u003e2.2 Basic Antennas 17\u003c\/p\u003e \u003cp\u003e2.2.1 Dipole 17\u003c\/p\u003e \u003cp\u003e2.2.2 Monopole 18\u003c\/p\u003e \u003cp\u003e2.2.3 Loop 18\u003c\/p\u003e \u003cp\u003e2.2.4 Slot 19\u003c\/p\u003e \u003cp\u003e2.3 Unusual Antennas 19\u003c\/p\u003e \u003cp\u003e2.3.1 Laminated Resonator Antenna 19\u003c\/p\u003e \u003cp\u003e2.3.2 Dish-like Reflector Antenna 19\u003c\/p\u003e \u003cp\u003e2.3.3 Slab Waveguide Antenna 20\u003c\/p\u003e \u003cp\u003e2.3.4 Differentially Fed Aperture Antenna 20\u003c\/p\u003e \u003cp\u003e2.3.5 Step-profiled Corrugated Horn Antenna 21\u003c\/p\u003e \u003cp\u003e2.4 Microstrip Patch Antennas 21\u003c\/p\u003e \u003cp\u003e2.4.1 Basic Patch Antennas 21\u003c\/p\u003e \u003cp\u003e2.4.2 Stacked Patch Antennas 25\u003c\/p\u003e \u003cp\u003e2.4.3 Patch Antenna Arrays 27\u003c\/p\u003e \u003cp\u003e2.5 Microstrip Grid Array Antennas 30\u003c\/p\u003e \u003cp\u003e2.5.1 Basic Configuration 31\u003c\/p\u003e \u003cp\u003e2.5.2 Principle of Operation 31\u003c\/p\u003e \u003cp\u003e2.5.3 Design Formulas with an Example 32\u003c\/p\u003e \u003cp\u003e2.6 Yagi-Uda Antennas 37\u003c\/p\u003e \u003cp\u003e2.6.1 Horizontal Yagi-Uda Antenna 38\u003c\/p\u003e \u003cp\u003e2.6.2 Vertical Yagi-Uda Antenna 38\u003c\/p\u003e \u003cp\u003e2.6.3 Yagi-Uda Antenna Array 39\u003c\/p\u003e \u003cp\u003e2.7 Magneto-Electric Dipole Antennas 41\u003c\/p\u003e \u003cp\u003e2.7.1 Single-polarized Microstrip Magneto-electric Dipole Antenna 42\u003c\/p\u003e \u003cp\u003e2.7.2 Dual-polarized Microstrip Magneto-electric Dipole Antenna 42\u003c\/p\u003e \u003cp\u003e2.7.3 Simulated and Measured Results 45\u003c\/p\u003e \u003cp\u003e2.8 Performance Improvement Techniques 45\u003c\/p\u003e \u003cp\u003e2.8.1 Single-layer Spiral AMC 49\u003c\/p\u003e \u003cp\u003e2.8.2 Design Guidelines 49\u003c\/p\u003e \u003cp\u003e2.8.3 A Design Example 50\u003c\/p\u003e \u003cp\u003e2.9 Summary 50\u003c\/p\u003e \u003cp\u003eAcknowledgements 50\u003c\/p\u003e \u003cp\u003eReferences 51\u003c\/p\u003e \u003cp\u003e\u003cb\u003e3 Packaging Technologies \u003c\/b\u003e\u003cb\u003e57\u003cbr\u003e\u003c\/b\u003e\u003ci\u003eNing Ye\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e3.1 Introduction 57\u003c\/p\u003e \u003cp\u003e3.2 Major Packaging Milestones 57\u003c\/p\u003e \u003cp\u003e3.3 Packaging Taxonomy 58\u003c\/p\u003e \u003cp\u003e3.3.1 Routing Layer in Packages 58\u003c\/p\u003e \u003cp\u003e3.3.1.1 Lead Frame 58\u003c\/p\u003e \u003cp\u003e3.3.1.2 Laminate 59\u003c\/p\u003e \u003cp\u003e3.3.1.3 Redistribution Layer 61\u003c\/p\u003e \u003cp\u003e3.3.2 Die to Routing Layer Interconnect 62\u003c\/p\u003e \u003cp\u003e3.3.2.1 Wire Bonds 62\u003c\/p\u003e \u003cp\u003e3.3.2.2 Flip Chips 63\u003c\/p\u003e \u003cp\u003e3.4 Packaging Process for Several Major Packages 64\u003c\/p\u003e \u003cp\u003e3.4.1 Wire Bond Plastic Ball Grid Array 64\u003c\/p\u003e \u003cp\u003e3.4.1.1 Die Preparation 66\u003c\/p\u003e \u003cp\u003e3.4.1.2 Die Attach 66\u003c\/p\u003e \u003cp\u003e3.4.1.3 Wire Bonding 67\u003c\/p\u003e \u003cp\u003e3.4.1.4 Molding 69\u003c\/p\u003e \u003cp\u003e3.4.1.5 Ball Mounting 71\u003c\/p\u003e \u003cp\u003e3.4.1.6 Package Singulation 71\u003c\/p\u003e \u003cp\u003e3.4.2 Wire Bond Quad Flat No-Lead Packages 71\u003c\/p\u003e \u003cp\u003e3.4.3 Flip-chip Plastic Ball Grid Arrays 73\u003c\/p\u003e \u003cp\u003e3.4.3.1 Flip-chip Bumping 73\u003c\/p\u003e \u003cp\u003e3.4.3.2 Flip-chip Attach 75\u003c\/p\u003e \u003cp\u003e3.4.3.3 Underfill 76\u003c\/p\u003e \u003cp\u003e3.4.4 Wafer Level Packaging 77\u003c\/p\u003e \u003cp\u003e3.4.5 Fan Out Wafer Level Packaging 78\u003c\/p\u003e \u003cp\u003e3.5 Summary and Emerging Trends 79\u003c\/p\u003e \u003cp\u003eReferences 84\u003c\/p\u003e \u003cp\u003e\u003cb\u003e4 Electrical, Mechanical, and Thermal Co-Design \u003c\/b\u003e\u003cb\u003e89\u003cbr\u003e\u003c\/b\u003e\u003ci\u003eXiaoxiong Gu and Pritish Parida\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e4.1 Introduction 89\u003c\/p\u003e \u003cp\u003e4.2 Electrical, Warpage, and Thermomechanical Analysis for AiP Co-design 92\u003c\/p\u003e \u003cp\u003e4.2.1 28-GHz Phased Array Antenna Module Overview 92\u003c\/p\u003e \u003cp\u003e4.2.2 Thermomechanical Test Vehicle Overview 94\u003c\/p\u003e \u003cp\u003e4.2.3 Antenna Prototyping and Interconnect Characterization 96\u003c\/p\u003e \u003cp\u003e4.2.4 Warpage Analysis and Test 96\u003c\/p\u003e \u003cp\u003e4.2.5 Thermal Simulation and Characterization 98\u003c\/p\u003e \u003cp\u003e4.3 Thermal Management Considerations for Next-generation Heterogeneous Integrated Systems 102\u003c\/p\u003e \u003cp\u003e4.3.1 AiP Cooling Options Under Different Power Dissipation Conditions 102\u003c\/p\u003e \u003cp\u003e4.3.2 Thermal Management for Heterogeneous Integrated High-power Systems 108\u003c\/p\u003e \u003cp\u003eAcknowledgment 110\u003c\/p\u003e \u003cp\u003eReferences 110\u003c\/p\u003e \u003cp\u003e\u003cb\u003e5 Antenna-in-Package Measurements \u003c\/b\u003e\u003cb\u003e115\u003cbr\u003e\u003c\/b\u003e\u003ci\u003eA.C.F. Reniers, U. Johannsen, and A.B. Smolders\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e5.1 General Introduction and Antenna Parameters 115\u003c\/p\u003e \u003cp\u003e5.1.1 Antenna Measurement Concepts 115\u003c\/p\u003e \u003cp\u003e5.1.2 Field Regions 116\u003c\/p\u003e \u003cp\u003e5.1.3 Radiation Characteristics 118\u003c\/p\u003e \u003cp\u003e5.1.4 Polarization Properties of Antennas 120\u003c\/p\u003e \u003cp\u003e5.2 Impedance Measurements 123\u003c\/p\u003e \u003cp\u003e5.2.1 Circuit Representation of Antennas 123\u003c\/p\u003e \u003cp\u003e5.3 Anechoic Measurement Facility for Characterizing AiPs 128\u003c\/p\u003e \u003cp\u003e5.3.1 Design of the mmWave Anechoic Chamber 128\u003c\/p\u003e \u003cp\u003e5.3.2 Defining Antenna Measurement Uncertainty 129\u003c\/p\u003e \u003cp\u003e5.3.3 Uncertainty in the mmWave Antenna Test Facility 132\u003c\/p\u003e \u003cp\u003e5.3.4 Case Study AiP: Characterization of a mmWave Circularly Polarized Rod Antenna 132\u003c\/p\u003e \u003cp\u003e5.4 Over-the-air System-level Testing 139\u003c\/p\u003e \u003cp\u003e5.5 Summary and Conclusions 142\u003c\/p\u003e \u003cp\u003eReferences 142\u003c\/p\u003e \u003cp\u003e\u003cb\u003e6 Antenna-in-package Designs in Multilayered Low-temperature Co-fired Ceramic Platforms \u003c\/b\u003e\u003cb\u003e147\u003cbr\u003e\u003c\/b\u003e\u003ci\u003eAtif Shamim and Haoran Zhang\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e6.1 Introduction 147\u003c\/p\u003e \u003cp\u003e6.2 LTCC Technology 148\u003c\/p\u003e \u003cp\u003e6.2.1 Introduction 149\u003c\/p\u003e \u003cp\u003e6.2.2 LTCC Fabrication Process 150\u003c\/p\u003e \u003cp\u003e6.2.3 LTCC Material Suppliers and Manufacturing Foundries 151\u003c\/p\u003e \u003cp\u003e6.3 LTCC-based AiP 153\u003c\/p\u003e \u003cp\u003e6.3.1 SIW AiP 153\u003c\/p\u003e \u003cp\u003e6.3.2 mmWave AiP 156\u003c\/p\u003e \u003cp\u003e6.3.2.1 5G AiP 157\u003c\/p\u003e \u003cp\u003e6.3.2.2 WPAN (60-GHz) AiP 158\u003c\/p\u003e \u003cp\u003e6.3.2.3 Automotive Radar (79-GHz) AiP 159\u003c\/p\u003e \u003cp\u003e6.3.2.4 Imaging and Radar (94-GHz) AiP 160\u003c\/p\u003e \u003cp\u003e6.3.2.5 Sub-THz (Above-100-GHz) AiP 161\u003c\/p\u003e \u003cp\u003e6.3.3 Active Antenna in LTCC 162\u003c\/p\u003e \u003cp\u003e6.3.4 Gain Enhancement Techniques in LTCC 164\u003c\/p\u003e \u003cp\u003e6.3.5 Ferrite LTCC-based Antenna 167\u003c\/p\u003e \u003cp\u003e6.4 Challenges and Upcoming Trends in LTCC AiP 171\u003c\/p\u003e \u003cp\u003eReferences 172\u003c\/p\u003e \u003cp\u003e\u003cb\u003e7 Antenna Integration in Packaging Technology operating from 60 GHz up to 300 GHz (HDI-based AiP) \u003c\/b\u003e\u003cb\u003e179\u003cbr\u003e\u003c\/b\u003e\u003ci\u003eFrédéric Gianesello, Diane Titz, and Cyril Luxey\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e7.1 Organic Packaging Technology for AiP 179\u003c\/p\u003e \u003cp\u003e7.1.1 Organic Package Overview 179\u003c\/p\u003e \u003cp\u003e7.1.2 Buildup Architecture 180\u003c\/p\u003e \u003cp\u003e7.1.3 Industrial Material 182\u003c\/p\u003e \u003cp\u003e7.1.4 HDI Design Rules 183\u003c\/p\u003e \u003cp\u003e7.1.5 Assembly Constraints and Body Size 185\u003c\/p\u003e \u003cp\u003e7.2 Integration of AiP in Organic Packaging Technology Below 100 GHz 187\u003c\/p\u003e \u003cp\u003e7.2.1 Integration Strategy of the Antenna 187\u003c\/p\u003e \u003cp\u003e7.2.2 60-GHz AiP Modules 189\u003c\/p\u003e \u003cp\u003e7.2.3 94-GHz AiP Module 197\u003c\/p\u003e \u003cp\u003e7.3 Integration of AiP in Organic Packaging Technology in the 120–140-GHz Band 203\u003c\/p\u003e \u003cp\u003e7.3.1 120–140-GHz AiP Module 203\u003c\/p\u003e \u003cp\u003e7.3.2 Link Demonstration Using a BiCMOS Chip with the 120-GHz BGA Module 208\u003c\/p\u003e \u003cp\u003e7.4 Integration of AiP in Organic Packaging Technology Beyond 200 GHz 210\u003c\/p\u003e \u003cp\u003e7.5 Conclusion and Perspectives 214\u003c\/p\u003e \u003cp\u003eReferences 215\u003c\/p\u003e \u003cp\u003e\u003cb\u003e8 Antenna Integration in eWLB Package \u003c\/b\u003e\u003cb\u003e219\u003cbr\u003e\u003c\/b\u003e\u003ci\u003eMaciej Wojnowski and Klaus Pressel\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e8.1 Introduction 219\u003c\/p\u003e \u003cp\u003e8.2 The Embedded Wafer Level BGA Package 220\u003c\/p\u003e \u003cp\u003e8.2.1 Process Flow for the eWLB 222\u003c\/p\u003e \u003cp\u003e8.2.2 Vertical Interconnections in the eWLB 223\u003c\/p\u003e \u003cp\u003e8.2.3 Embedded Z-Line Technology 225\u003c\/p\u003e \u003cp\u003e8.3 Toolbox Elements for AiP in eWLB 227\u003c\/p\u003e \u003cp\u003e8.3.1 Transmission Lines 227\u003c\/p\u003e \u003cp\u003e8.3.2 Passive Components and Distributed RF Circuits 231\u003c\/p\u003e \u003cp\u003e8.3.3 RF Transition to PCB 238\u003c\/p\u003e \u003cp\u003e8.3.4 Vertical RF Transitions 239\u003c\/p\u003e \u003cp\u003e8.4 Antenna Integration in eWLB 243\u003c\/p\u003e \u003cp\u003e8.4.1 Single Antenna 244\u003c\/p\u003e \u003cp\u003e8.4.2 Antenna Array 245\u003c\/p\u003e \u003cp\u003e8.4.3 3D Antenna and Antenna Arrays 246\u003c\/p\u003e \u003cp\u003e8.5 Application Examples 249\u003c\/p\u003e \u003cp\u003e8.5.1 Two-channel 60-GHz Transceiver Module 249\u003c\/p\u003e \u003cp\u003e8.5.2 Four-channel 77-GHz Transceiver Module 253\u003c\/p\u003e \u003cp\u003e8.5.3 Six-channel 60-GHz Transceiver Module 258\u003c\/p\u003e \u003cp\u003e8.6 Conclusion 263\u003c\/p\u003e \u003cp\u003eAcknowledgement 263\u003c\/p\u003e \u003cp\u003eReferences 264\u003c\/p\u003e \u003cp\u003e\u003cb\u003e9 Additive Manufacturing AiP Designs and Applications \u003c\/b\u003e\u003cb\u003e267\u003cbr\u003e\u003c\/b\u003e\u003ci\u003eTong-Hong Lin, Ryan A. Bahr, and Manos M. Tentzeris\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e9.1 Introduction 267\u003c\/p\u003e \u003cp\u003e9.2 Additive Manufacturing Technologies 269\u003c\/p\u003e \u003cp\u003e9.2.1 Inkjet Printing 269\u003c\/p\u003e \u003cp\u003e9.2.2 FDM 3D Printing 269\u003c\/p\u003e \u003cp\u003e9.2.3 SLA 3D Printing 270\u003c\/p\u003e \u003cp\u003e9.3 Material Characterization 272\u003c\/p\u003e \u003cp\u003e9.3.1 Resonator-based Material Characterization 273\u003c\/p\u003e \u003cp\u003e9.3.2 Transmissive-based Material Characterization 274\u003c\/p\u003e \u003cp\u003e9.4 Recent Advances in AM for Packaging 275\u003c\/p\u003e \u003cp\u003e9.4.1 Interconnects 276\u003c\/p\u003e \u003cp\u003e9.4.2 AiP 277\u003c\/p\u003e \u003cp\u003e9.5 Fabrication Process 278\u003c\/p\u003e \u003cp\u003e9.5.1 3D Printing Process 278\u003c\/p\u003e \u003cp\u003e9.5.2 Inkjet Printing Process 280\u003c\/p\u003e \u003cp\u003e9.5.3 AiP Fabrication Process 281\u003c\/p\u003e \u003cp\u003e9.6 AiP and SoP using AM Technologies 282\u003c\/p\u003e \u003cp\u003e9.6.1 AiP Design 282\u003c\/p\u003e \u003cp\u003e9.6.2 SoP Design 284\u003c\/p\u003e \u003cp\u003e9.7 Summary and Prospect 287\u003c\/p\u003e \u003cp\u003eReferences 289\u003c\/p\u003e \u003cp\u003e\u003cb\u003e10 SLC-based AiP for Phased Array Applications \u003c\/b\u003e\u003cb\u003e293\u003cbr\u003e\u003c\/b\u003e\u003ci\u003eDuixian Liu and Xiaoxiong Gu\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e10.1 Introduction 293\u003c\/p\u003e \u003cp\u003e10.2 SLC Technology 296\u003c\/p\u003e \u003cp\u003e10.3 AiP for 5G Base Station Applications 297\u003c\/p\u003e \u003cp\u003e10.3.1 Package and Antenna Structure 298\u003c\/p\u003e \u003cp\u003e10.3.2 AiP Design Considerations 299\u003c\/p\u003e \u003cp\u003e10.3.2.1 Surface Wave Effects 299\u003c\/p\u003e \u003cp\u003e10.3.2.2 Vertical Transitions 300\u003c\/p\u003e \u003cp\u003e10.3.3 Aperture-coupled Patch Antenna Design 302\u003c\/p\u003e \u003cp\u003e10.3.4 28-GHz Aperture-coupled Cavity-backed Patch Array Design 307\u003c\/p\u003e \u003cp\u003e10.3.5 Passive Antenna Element Characterization 309\u003c\/p\u003e \u003cp\u003e10.3.6 Active Module Characterization of 64-element Beams 310\u003c\/p\u003e \u003cp\u003e10.3.7 28-GHz AiP Phased-array Conclusion 314\u003c\/p\u003e \u003cp\u003e10.4 94-GHz Scalable AiP Phased-array Applications 315\u003c\/p\u003e \u003cp\u003e10.4.1 Scalable Phased-array Concept 317\u003c\/p\u003e \u003cp\u003e10.4.2 94-GHz Antenna Prototype Designs 320\u003c\/p\u003e \u003cp\u003e10.4.3 94-GHz Antenna Prototype Evaluation 322\u003c\/p\u003e \u003cp\u003e10.4.4 94-GHz AiP Array Design 322\u003c\/p\u003e \u003cp\u003e10.4.5 Package Modeling and Simulation 326\u003c\/p\u003e \u003cp\u003e10.4.6 Package Assembly and Test 328\u003c\/p\u003e \u003cp\u003e10.4.7 Antenna Pattern and Radiated Power Measurement 330\u003c\/p\u003e \u003cp\u003eAcknowledgment 333\u003c\/p\u003e \u003cp\u003eReferences 334\u003c\/p\u003e \u003cp\u003e\u003cb\u003e11 3D AiP for Power Transfer, Sensor Nodes, and IoT Applications \u003c\/b\u003e\u003cb\u003e341\u003cbr\u003e\u003c\/b\u003e\u003ci\u003eAmin Enayati, Karim Mohammadpour-Aghdam, and Farbod Molaee-Ghaleh\u003c\/i\u003e\u003c\/p\u003e \u003cp\u003e11.1 Introduction 341\u003c\/p\u003e \u003cp\u003e11.2 Small Antenna Design and Miniaturization Techniques 342\u003c\/p\u003e \u003cp\u003e11.2.1 Physical Bounds on the Radiation \u003ci\u003eQ\u003c\/i\u003e-factor for Antenna Structures 342\u003c\/p\u003e \u003cp\u003e11.2.1.1 Lower Bounds on Antenna Enclosed in a Sphere: Chu, McLean, and Thal Limits 342\u003c\/p\u003e \u003cp\u003e11.2.1.2 Lower Bounds on Antenna Enclosed in an Arbitrary Structure: Gustafsson–Yaghjian Limit 343\u003c\/p\u003e \u003cp\u003e11.2.2 Figure of Merit for Antenna Miniaturization 345\u003c\/p\u003e \u003cp\u003e11.2.2.1 Relation between \u003ci\u003eQ\u003c\/i\u003e-factor and Antenna Input Impedance 345\u003c\/p\u003e \u003cp\u003e11.2.2.2 Antenna Efficiency Effect on the Radiation \u003ci\u003eQ \u003c\/i\u003e346\u003c\/p\u003e \u003cp\u003e11.2.2.3 Cross-polarization Effect on Antenna Radiation \u003ci\u003eQ \u003c\/i\u003e346\u003c\/p\u003e \u003cp\u003e11.2.2.4 Figure of Merit Definition 346\u003c\/p\u003e \u003cp\u003e11.2.3 Antenna Miniaturization Techniques 346\u003c\/p\u003e \u003cp\u003e11.2.3.1 Miniaturization through Geometrical Shaping of the Antenna 347\u003c\/p\u003e \u003cp\u003e11.2.3.2 Miniaturization through Material Loading 349\u003c\/p\u003e \u003cp\u003e11.3 Multi-mode Capability: A Way to Achieve Wideband Antennas 354\u003c\/p\u003e \u003cp\u003e11.4 Miniaturized Antenna Solutions for Power Transfer and Energy Harvesting Applications 355\u003c\/p\u003e \u003cp\u003e11.4.1 Integrated Antenna Design Challenges for WPT and Scavenging Systems 356\u003c\/p\u003e \u003cp\u003e11.4.1.1 Conjugate Impedance Matching 356\u003c\/p\u003e \u003cp\u003e11.4.1.2 Antenna Structure Selection 357\u003c\/p\u003e \u003cp\u003e11.4.2 Small Antenna Structure that can be Optimized for Arbitrary Input Impedance 357\u003c\/p\u003e \u003cp\u003e11.4.2.1 Basic Antenna Structure 357\u003c\/p\u003e \u003cp\u003e11.4.2.2 Antenna Size Reduction by Folding 358\u003c\/p\u003e \u003cp\u003e11.4.2.3 Final Antenna Structure and Parameter Analysis 358\u003c\/p\u003e \u003cp\u003e11.4.3 Example of an AiP Solution for On-chip Scavenging\/UWB Applications 360\u003c\/p\u003e \u003cp\u003e11.5 AiP Solutions in Low-cost PCB Technology 364\u003c\/p\u003e \u003cp\u003e11.5.1 Introduction to Wireless Sensor Networks and IoT 364\u003c\/p\u003e \u003cp\u003e11.5.1.1 Examples of Antennas for IoT Devices 365\u003c\/p\u003e \u003cp\u003e11.5.2 3D System-in-Package Solutions for Microwave Wireless Devices 365\u003c\/p\u003e \u003cp\u003e11.5.3 E-CUBE: A 3D SiP Solution 368\u003c\/p\u003e \u003cp\u003e11.5.3.1 Multilayer Flex-rigid PCB for Antenna Element Design 369\u003c\/p\u003e \u003cp\u003e11.5.3.2 Modular Design of the Antenna Array and Power Distribution Network 371\u003c\/p\u003e \u003cp\u003e11.5.3.3 Construction and Measurement Results 374\u003c\/p\u003e \u003cp\u003eReferences 377\u003c\/p\u003e \u003cp\u003eIndex 385\u003c\/p\u003e","brand":"John Wiley \u0026 Sons Inc","offers":[{"title":"Default Title","offer_id":49407082627415,"sku":"9781119556633","price":98.06,"currency_code":"GBP","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0817\/1739\/5799\/files\/9781119556633.jpg?v=1730498118","url":"https:\/\/bookcurl.com\/products\/antennainpackage-technology-and-applications-9781119556633","provider":"Book Curl","version":"1.0","type":"link"}