{"product_id":"an-introduction-to-surface-analysis-by-xps-and-aes-9781119417583","title":"An Introduction to Surface Analysis by XPS and","description":"\u003cb\u003eBook Synopsis\u003c\/b\u003e\u003cbr\u003e\u003cp\u003e\u003cb\u003eProvides a concise yet comprehensive introduction to XPS and AES techniques in surface analysis\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003eThis accessible second edition of the bestselling book, \u003ci\u003eAn Introduction to Surface Analysis by XPS and AES, 2nd Edition\u003c\/i\u003e explores the basic principles and applications of X-ray Photoelectron Spectroscopy (XPS) and Auger Electron Spectroscopy (AES) techniques. It starts with an examination of the basic concepts of electron spectroscopy and electron spectrometer design, followed by a qualitative and quantitative interpretation of the electron spectrum.\u003c\/p\u003e \u003cp\u003eChapters examine recent innovations in instrument design and key applications in metallurgy, biomaterials, and electronics. Practical and concise, it includes compositional depth profiling; multi-technique analysis; and everything about samplesincluding their handling, preparation, stability, and more. Topics discussed in more depth include peak fitting, energy loss background analysis, multi-technique analysis, and\u003cbr\u003e\u003cbr\u003e\u003cb\u003eTable of Contents\u003c\/b\u003e\u003cbr\u003e\u003c\/p\u003e\u003cp\u003ePreface to First Edition xi\u003c\/p\u003e \u003cp\u003ePreface to Second Edition xiii\u003c\/p\u003e \u003cp\u003eAcknowledgements xvii\u003c\/p\u003e \u003cp\u003e\u003cb\u003e1 Electron Spectroscopy: Some Basic Concepts 1\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e1.1 Analysis of Surfaces 1\u003c\/p\u003e \u003cp\u003e1.2 Notation 3\u003c\/p\u003e \u003cp\u003e1.2.1 Spectroscopists’ Notation 3\u003c\/p\u003e \u003cp\u003e1.2.2 X‐ray Notation 4\u003c\/p\u003e \u003cp\u003e1.3 X‐ray Photoelectron Spectroscopy 4\u003c\/p\u003e \u003cp\u003e1.4 Auger Electron Spectroscopy (AES) 8\u003c\/p\u003e \u003cp\u003e1.5 Scanning Auger Microscopy 12\u003c\/p\u003e \u003cp\u003e1.6 The Depth of Analysis in Electron Spectroscopy 13\u003c\/p\u003e \u003cp\u003e1.7 Comparison of XPS and AES\/SAM 16\u003c\/p\u003e \u003cp\u003e1.8 The Availability of Surface Analytical Equipment 17\u003c\/p\u003e \u003cp\u003e\u003cb\u003e2 Electron Spectrometer Design 19\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e2.1 Introduction 19\u003c\/p\u003e \u003cp\u003e2.2 The Vacuum System 19\u003c\/p\u003e \u003cp\u003e2.3 X‐ray Sources for XPS 22\u003c\/p\u003e \u003cp\u003e2.3.1 Choice of X‐ray Anode 23\u003c\/p\u003e \u003cp\u003e2.3.2 X‐ray Monochromators 27\u003c\/p\u003e \u003cp\u003e2.3.3 Synchrotron Sources 30\u003c\/p\u003e \u003cp\u003e2.4 The Electron Gun for AES 31\u003c\/p\u003e \u003cp\u003e2.4.1 Electron Sources 31\u003c\/p\u003e \u003cp\u003e2.4.1.1 Thermionic Emitter 32\u003c\/p\u003e \u003cp\u003e2.4.1.2 Lanthanum Hexaboride Emitter 32\u003c\/p\u003e \u003cp\u003e2.4.1.3 Cold Field Emitter 32\u003c\/p\u003e \u003cp\u003e2.4.1.4 Hot Field Emitter 33\u003c\/p\u003e \u003cp\u003e2.4.1.5 Comparison of Electron Emitters for AES 34\u003c\/p\u003e \u003cp\u003e2.4.2 The Electron Column 35\u003c\/p\u003e \u003cp\u003e2.4.3 Spot Size 35\u003c\/p\u003e \u003cp\u003e2.5 Analysers for Electron Spectroscopy 37\u003c\/p\u003e \u003cp\u003e2.5.1 The Cylindrical Mirror Analyser 38\u003c\/p\u003e \u003cp\u003e2.5.2 The Hemispherical Sector Analyser 41\u003c\/p\u003e \u003cp\u003e2.5.2.1 CAE Mode of Operation 42\u003c\/p\u003e \u003cp\u003e2.5.2.2 CRR Mode of Operation 44\u003c\/p\u003e \u003cp\u003e2.5.2.3 Comparison of CAE and CRR Modes 46\u003c\/p\u003e \u003cp\u003e2.5.2.4 The Transfer Lens 47\u003c\/p\u003e \u003cp\u003e2.5.3 Calibration of the Electron Spectrometer Energy Scale 48\u003c\/p\u003e \u003cp\u003e2.6 Near Ambient Pressure XPS 49\u003c\/p\u003e \u003cp\u003e2.7 Detectors 52\u003c\/p\u003e \u003cp\u003e2.7.1 Channel Electron Multipliers 52\u003c\/p\u003e \u003cp\u003e2.7.2 Microchannel Plates 54\u003c\/p\u003e \u003cp\u003e2.7.3 Two‐Dimensional Detectors 54\u003c\/p\u003e \u003cp\u003e2.7.3.1 The Resistive‐Anode Detector 55\u003c\/p\u003e \u003cp\u003e2.7.3.2 The Delay‐Line Detector 55\u003c\/p\u003e \u003cp\u003e2.8 Small Area XPS 56\u003c\/p\u003e \u003cp\u003e2.8.1 Lens‐Defined Small Area XPS 56\u003c\/p\u003e \u003cp\u003e2.8.2 Source-defined Small Area Analysis 57\u003c\/p\u003e \u003cp\u003e2.9 XPS Imaging and Mapping 57\u003c\/p\u003e \u003cp\u003e2.9.1 Serial Acquisition 58\u003c\/p\u003e \u003cp\u003e2.9.2 Parallel Acquisition 59\u003c\/p\u003e \u003cp\u003e2.9.2.1 Parallel Imaging Using a Hemispherical Spectrometer 59\u003c\/p\u003e \u003cp\u003e2.9.2.2 Parallel Imaging Using a Spherical Mirror Analyser 60\u003c\/p\u003e \u003cp\u003e2.9.2.3 Spatial Resolution and Chemical Imaging 61\u003c\/p\u003e \u003cp\u003e2.10 Angle Resolved XPS 64\u003c\/p\u003e \u003cp\u003e2.11 Automation 66\u003c\/p\u003e \u003cp\u003e\u003cb\u003e3 The Electron Spectrum: Qualitative and Quantitative Interpretation 69\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e3.1 Introduction 69\u003c\/p\u003e \u003cp\u003e3.2 Qualitative Analysis 69\u003c\/p\u003e \u003cp\u003e3.2.1 Unwanted Features in Electron Spectra 72\u003c\/p\u003e \u003cp\u003e3.2.2 Data Acquisition 72\u003c\/p\u003e \u003cp\u003e3.2.2.1 Core Level Spectra 72\u003c\/p\u003e \u003cp\u003e3.2.2.2 Valence Band Spectra 73\u003c\/p\u003e \u003cp\u003e3.3 Chemical State Information 74\u003c\/p\u003e \u003cp\u003e3.3.1 X‐ray Photoelectron Spectroscopy 74\u003c\/p\u003e \u003cp\u003e3.3.2 Peak Fitting of XPS Spectra 78\u003c\/p\u003e \u003cp\u003e3.3.3 Auger Electron Spectroscopy 81\u003c\/p\u003e \u003cp\u003e3.3.4 X‐AES 82\u003c\/p\u003e \u003cp\u003e3.3.5 Chemical State Plots 84\u003c\/p\u003e \u003cp\u003e3.3.6 Shakeup Satellites 86\u003c\/p\u003e \u003cp\u003e3.3.7 Multiplet Splitting 87\u003c\/p\u003e \u003cp\u003e3.3.8 Plasmons 87\u003c\/p\u003e \u003cp\u003e3.4 Quantitative Analysis 88\u003c\/p\u003e \u003cp\u003e3.4.1 Quantification in XPS 89\u003c\/p\u003e \u003cp\u003e3.4.1.1 Calculating Atomic Concentration 89\u003c\/p\u003e \u003cp\u003e3.4.1.2 Measuring Peak Intensity 92\u003c\/p\u003e \u003cp\u003e3.4.2 Quantification in AES 94\u003c\/p\u003e \u003cp\u003e\u003cb\u003e4 Compositional Depth Profiling 97\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e4.1 Introduction 97\u003c\/p\u003e \u003cp\u003e4.2 Non‐destructive Depth Methods 98\u003c\/p\u003e \u003cp\u003e4.2.1 Measurements at a Single Emission Angle 98\u003c\/p\u003e \u003cp\u003e4.2.2 Angle Resolved XPS Measurements 99\u003c\/p\u003e \u003cp\u003e4.2.3 Measurement of Overlayer Thickness Using ARXPS 101\u003c\/p\u003e \u003cp\u003e4.2.4 Elastic Scattering 103\u003c\/p\u003e \u003cp\u003e4.2.5 Multilayer Thickness Calculations Using ARXPS 104\u003c\/p\u003e \u003cp\u003e4.2.6 Compositional Depth Profiles from ARXPS Measurements 107\u003c\/p\u003e \u003cp\u003e4.2.7 Variation of Analysis Depth with Electron Kinetic Energy 110\u003c\/p\u003e \u003cp\u003e4.2.8 Background Analysis 112\u003c\/p\u003e \u003cp\u003e4.3 Depth Profiling by Sputtering with Energetic Ions 115\u003c\/p\u003e \u003cp\u003e4.3.1 The Sputtering Process 115\u003c\/p\u003e \u003cp\u003e4.3.2 Experimental Method 116\u003c\/p\u003e \u003cp\u003e4.3.3 The Nature of the Ion Beam 118\u003c\/p\u003e \u003cp\u003e4.3.3.1 Noble Gas Ions 118\u003c\/p\u003e \u003cp\u003e4.3.3.2 Cluster Ions 119\u003c\/p\u003e \u003cp\u003e4.3.3.3 Metal Ions 121\u003c\/p\u003e \u003cp\u003e4.3.4 Sputter Yield and Etch Rate 122\u003c\/p\u003e \u003cp\u003e4.3.5 Factors Affecting the Etch Rate 123\u003c\/p\u003e \u003cp\u003e4.3.5.1 Material 123\u003c\/p\u003e \u003cp\u003e4.3.5.2 Ion Current 123\u003c\/p\u003e \u003cp\u003e4.3.5.3 Ion Energy 123\u003c\/p\u003e \u003cp\u003e4.3.5.4 Nature of the Ion Beam 124\u003c\/p\u003e \u003cp\u003e4.3.5.5 Angle of Incidence 124\u003c\/p\u003e \u003cp\u003e4.3.6 Factors Affecting the Depth Resolution 124\u003c\/p\u003e \u003cp\u003e4.3.6.1 Ion Beam Characteristics 124\u003c\/p\u003e \u003cp\u003e4.3.6.2 Crater Quality 125\u003c\/p\u003e \u003cp\u003e4.3.6.3 Beam Impurities 125\u003c\/p\u003e \u003cp\u003e4.3.6.4 Information Depth 126\u003c\/p\u003e \u003cp\u003e4.3.6.5 Original Surface Roughness 127\u003c\/p\u003e \u003cp\u003e4.3.6.6 Induced Roughness 127\u003c\/p\u003e \u003cp\u003e4.3.6.7 Preferential Sputtering 127\u003c\/p\u003e \u003cp\u003e4.3.6.8 Redeposition of Sputtered Material 128\u003c\/p\u003e \u003cp\u003e4.3.7 Calibration 128\u003c\/p\u003e \u003cp\u003e4.3.8 Ion Gun Design 128\u003c\/p\u003e \u003cp\u003e4.3.8.1 Electron Impact Ion Guns 128\u003c\/p\u003e \u003cp\u003e4.3.8.2 Argon‐Cluster Ion Guns 129\u003c\/p\u003e \u003cp\u003e4.3.8.3 Liquid Metal Ion Guns 131\u003c\/p\u003e \u003cp\u003e4.4 Sectioning 131\u003c\/p\u003e \u003cp\u003e4.4.1 FIB Sectioning 131\u003c\/p\u003e \u003cp\u003e4.4.2 Angle Lapping 132\u003c\/p\u003e \u003cp\u003e4.4.3 Ball Cratering 133\u003c\/p\u003e \u003cp\u003e\u003cb\u003e5 Multi‐technique Analysis 135\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e5.1 Introduction 135\u003c\/p\u003e \u003cp\u003e5.2 Ultraviolet Photoelectron Spectroscopy (UPS) 135\u003c\/p\u003e \u003cp\u003e5.3 Low Energy Ion Scattering Spectroscopy (LEISS) 137\u003c\/p\u003e \u003cp\u003e5.4 Reflection Electron Energy Loss Spectroscopy (REELS) 139\u003c\/p\u003e \u003cp\u003e5.4.1 Elastic Scattering 140\u003c\/p\u003e \u003cp\u003e5.4.2 Inelastic Scattering 141\u003c\/p\u003e \u003cp\u003e5.5 Work Function Measurements 142\u003c\/p\u003e \u003cp\u003e5.6 Energy Dispersive X‐ray Analysis (EDX) 143\u003c\/p\u003e \u003cp\u003e\u003cb\u003e6 The Sample 145\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e6.1 Sample Handling 145\u003c\/p\u003e \u003cp\u003e6.2 Sample Preparation 147\u003c\/p\u003e \u003cp\u003e6.3 Sample Mounting 149\u003c\/p\u003e \u003cp\u003e6.4 Sample Stability 149\u003c\/p\u003e \u003cp\u003e6.5 Contamination and Damage During Analysis 151\u003c\/p\u003e \u003cp\u003e6.6 Controlling Sample Charging 152\u003c\/p\u003e \u003cp\u003e6.6.1 Sample Charging in XPS 152\u003c\/p\u003e \u003cp\u003e6.6.2 Sample Charging in AES 154\u003c\/p\u003e \u003cp\u003e\u003cb\u003e7 Applications of Electron Spectroscopy in Materials Science 157\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e7.1 Introduction 157\u003c\/p\u003e \u003cp\u003e7.2 Metallurgy 157\u003c\/p\u003e \u003cp\u003e7.2.1 Grain Boundary Segregation 158\u003c\/p\u003e \u003cp\u003e7.2.2 Electronic Structure of Metallic Alloys 160\u003c\/p\u003e \u003cp\u003e7.2.3 Surface Engineering 163\u003c\/p\u003e \u003cp\u003e7.3 Corrosion Science 168\u003c\/p\u003e \u003cp\u003e7.4 Ceramics 176\u003c\/p\u003e \u003cp\u003e7.5 Microelectronics and Semiconductor Materials 181\u003c\/p\u003e \u003cp\u003e7.5.1 Mapping Semiconductor Devices Using AES 182\u003c\/p\u003e \u003cp\u003e7.5.2 XPS Failure Analysis of Microelectronic Devices 186\u003c\/p\u003e \u003cp\u003e7.5.3 Depth Profiling of Semiconductor Materials 188\u003c\/p\u003e \u003cp\u003e7.5.3.1 Transistor Gate Dielectrics 188\u003c\/p\u003e \u003cp\u003e7.5.3.2 Inorganic Chemical State Profiling 189\u003c\/p\u003e \u003cp\u003e7.5.3.3 Organic Semiconductor Profiling 190\u003c\/p\u003e \u003cp\u003e7.6 Polymeric Materials 193\u003c\/p\u003e \u003cp\u003e7.7 Adhesion Science 202\u003c\/p\u003e \u003cp\u003e7.8 Nanotechnology 210\u003c\/p\u003e \u003cp\u003e7.9 Biology 215\u003c\/p\u003e \u003cp\u003e7.10 Energy 219\u003c\/p\u003e \u003cp\u003e\u003cb\u003e8 Comparison of XPS and AES with Other Analytical Techniques 223\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003eGlossary 229\u003c\/p\u003e \u003cp\u003eBibliography 239\u003c\/p\u003e \u003cp\u003e\u003cb\u003eAppendix 1 247\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003eAuger Electron Energies 247\u003c\/p\u003e \u003cp\u003e\u003cb\u003eAppendix 2 249\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003eTable of Binding Energies Accessible with Al Kα Radiation 250\u003c\/p\u003e \u003cp\u003e\u003cb\u003eAppendix 3 255\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003eDocumentary Standards in Surface Analysis 255\u003c\/p\u003e \u003cp\u003eThe Scope of TC201 255\u003c\/p\u003e \u003cp\u003eThe Purpose of TC201 255\u003c\/p\u003e \u003cp\u003eInternational Standards Relevant to Electron Spectroscopies 256\u003c\/p\u003e \u003cp\u003eIndex 259\u003c\/p\u003e","brand":"John Wiley \u0026 Sons Inc","offers":[{"title":"Default Title","offer_id":49407049236823,"sku":"9781119417583","price":62.65,"currency_code":"GBP","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0817\/1739\/5799\/files\/9781119417583.jpg?v=1730498001","url":"https:\/\/bookcurl.com\/products\/an-introduction-to-surface-analysis-by-xps-and-aes-9781119417583","provider":"Book Curl","version":"1.0","type":"link"}