{"product_id":"advanced-electronic-packaging-9-ieee-press-series-on-microelectronic-systems-9780471466093","title":"Advanced Electronic Packaging 9 IEEE Press Series on Microelectronic Systems","description":"\u003cb\u003eBook Synopsis\u003c\/b\u003e\u003cbr\u003eThis book updates the book, Advanced Electronic Packaging: With Emphasis on Multichip Modules, Ed.W.D. Brown, IEEE Press, copyright 1999. The original edition of the book has been widely adopted by industry and has been and is still being adopted by universities for graduate courses.\u003cbr\u003e\u003cbr\u003e\u003cb\u003eTrade Review\u003c\/b\u003e\u003cbr\u003e\"…a very nice reference.\" (\u003ci\u003eIEEE Circuits \u0026amp; Devices Magazine\u003c\/i\u003e, November\/December 2006)  \u003cp\u003e\"...offers a broad perspective on electronic packaging.\" (\u003ci\u003eAdvanced Packaging Online\u003c\/i\u003e, August 11, 2006)\u003c\/p\u003e \u003cp\u003e\"...an extremely thorough engineering textbook and an invaluable reference tool...get ready for some serious reading that will pay off.\" (\u003ci\u003eChip Scale Review\u003c\/i\u003e, July 2006)\u003c\/p\u003e \u003cp\u003e\"…useful to not only students but also to both new and experienced engineers working in areas related to semiconductor and electronic packaging technologies.\" (\u003ci\u003eCircuiTree\u003c\/i\u003e, May 1, 2006)\u003c\/p\u003e\u003cbr\u003e\u003cbr\u003e\u003cb\u003eTable of Contents\u003c\/b\u003e\u003cbr\u003eChapter 1: Introduction and overview of microelectronic packaging.  \u003cp\u003eChapter 2: Materials for microelectronic packaging.\u003c\/p\u003e \u003cp\u003eChapter 3: Processing technologies.\u003c\/p\u003e \u003cp\u003eChapter 4: Organic printed circuit board materials and processes.\u003c\/p\u003e \u003cp\u003eChapter 5: Ceramic substrates.\u003c\/p\u003e \u003cp\u003eChapter 6: Electrical considerations, modeling, and simulation.\u003c\/p\u003e \u003cp\u003eChapter 7: Thermal considerations.\u003c\/p\u003e \u003cp\u003eChapter 8: Mechanical design considerations.\u003c\/p\u003e \u003cp\u003eChapter 9: Discrete and embedded passive devices.\u003c\/p\u003e \u003cp\u003eChapter 10: Electronic package assembly.\u003c\/p\u003e \u003cp\u003eChapter 11: Design considerations.\u003c\/p\u003e \u003cp\u003eChapter 12: Radio frequency and microwave packaging.\u003c\/p\u003e \u003cp\u003eChapter 13: Power electronics packaging.\u003c\/p\u003e \u003cp\u003eChapter 14: Multichip and three-dimensional packaging.\u003c\/p\u003e \u003cp\u003eChapter 15: Packaging of MEMS and MOEMS: challenges and a case study.\u003c\/p\u003e \u003cp\u003eChapter 16: Reliability considerations.\u003c\/p\u003e \u003cp\u003eChapter 17: Cost evaluation and analysis.\u003c\/p\u003e \u003cp\u003eChapter 18: Analytical techniques for materials characterization.\u003c\/p\u003e","brand":"Wiley","offers":[{"title":"Default Title","offer_id":53515427676503,"sku":"9780471466093","price":148.45,"currency_code":"GBP","in_stock":true}],"url":"https:\/\/bookcurl.com\/products\/advanced-electronic-packaging-9-ieee-press-series-on-microelectronic-systems-9780471466093","provider":"Book Curl","version":"1.0","type":"link"}